| ETSCHMAIER, Harald, Jiří NOVÁK, Hannes EDER a Peter HADLEY. Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates. Intermetallics. Netherlands: Elsevier, 2012, roč. 20, č. 1, s. 87-92. ISSN 0966-9795. Dostupné z: https://dx.doi.org/10.1016/j.intermet.2011.08.014. |
Další formáty:
BibTeX
LaTeX
RIS
@article{1123342,
author = {Etschmaier, Harald and Novák, Jiří and Eder, Hannes and Hadley, Peter},
article_location = {Netherlands},
article_number = {1},
doi = {http://dx.doi.org/10.1016/j.intermet.2011.08.014},
keywords = {Nanostructured intermetallics; Phase transformation; Phase identification; Joining; Thin films},
language = {eng},
issn = {0966-9795},
journal = {Intermetallics},
title = {Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates},
volume = {20},
year = {2012}
}
TY - JOUR
ID - 1123342
AU - Etschmaier, Harald - Novák, Jiří - Eder, Hannes - Hadley, Peter
PY - 2012
TI - Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates
JF - Intermetallics
VL - 20
IS - 1
SP - 87-92
EP - 87-92
PB - Elsevier
SN - 09669795
KW - Nanostructured intermetallics
KW - Phase transformation
KW - Phase identification
KW - Joining
KW - Thin films
ER -
ETSCHMAIER, Harald, Jiří NOVÁK, Hannes EDER a Peter HADLEY. Reaction dynamics of diffusion soldering with the eutectic Au-Sn alloy on copper and silver substrates. \textit{Intermetallics}. Netherlands: Elsevier, 2012, roč.~20, č.~1, s.~87-92. ISSN~0966-9795. Dostupné z: https://dx.doi.org/10.1016/j.intermet.2011.08.014.
|
