Detailed Information on Publication Record
2016
Preparation of (001) preferentially oriented titanium thin films by ion-beam sputtering deposition on thermal silicon dioxide
GABLECH, Imrich, Vojtěch SVATOŠ, Ondřej CAHA, Milos HRABOVSKY, Jan PRASEK et. al.Basic information
Original name
Preparation of (001) preferentially oriented titanium thin films by ion-beam sputtering deposition on thermal silicon dioxide
Authors
GABLECH, Imrich (203 Czech Republic), Vojtěch SVATOŠ (203 Czech Republic), Ondřej CAHA (203 Czech Republic, guarantor, belonging to the institution), Milos HRABOVSKY (203 Czech Republic), Jan PRASEK (203 Czech Republic), Jaromír HUBÁLEK (203 Czech Republic) and Tomáš ŠIKOLA (203 Czech Republic)
Edition
Journal of materials science, NEW YORK, Springer, 2016, 0022-2461
Other information
Language
English
Type of outcome
Článek v odborném periodiku
Field of Study
20201 Electrical and electronic engineering
Country of publisher
United States of America
Confidentiality degree
není předmětem státního či obchodního tajemství
References:
Impact factor
Impact factor: 2.599
RIV identification code
RIV/00216224:14740/16:00093661
Organization unit
Central European Institute of Technology
UT WoS
000368054100005
Keywords in English
titanium; sputtering; x-ray diffraction
Tags
International impact, Reviewed
Změněno: 1/3/2019 11:36, doc. Mgr. Ondřej Caha, Ph.D.
V originále
We propose the ion-beam sputtering deposition providing Ti thin films of desired crystallographic orientation and smooth surface morphology not obtainable with conventional deposition techniques such as magnetron sputtering and vacuum evaporation. The sputtering was provided by argon broad ion beams generated by a Kaufman ion-beam source. In order to achieve the optimal properties of thin film, we investigated the Ti thin films deposited on an amorphous thermal silicon dioxide using X-ray diffraction, and atomic force microscopy. We have optimized deposition conditions for growing of thin films with the only (001) preferential orientation of film crystallites, and achieved ultra-low surface roughness of 0.55 nm. The deposited films have been found to be stable upon annealing up to 300 A degrees C which is often essential for envisaging subsequent deposition of piezoelectric AlN thin films.
In Czech
We propose the ion-beam sputtering deposition providing Ti thin films of desired crystallographic orientation and smooth surface morphology not obtainable with conventional deposition techniques such as magnetron sputtering and vacuum evaporation.
Links
ED1.1.00/02.0068, research and development project |
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LM2011020, research and development project |
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