KOTILAINEN, Minna Paula Katriina, Richard KRUMPOLEC, Daniel FRANTA, Pavel SOUČEK, Tomáš HOMOLA, David Campbell CAMERON and Petri VUORISTO. Hafnium oxide thin films as a barrier against copper diffusion in solar absorbers. Solar Energy Materials and Solar Cells. AMSTERDAM, NETHERLANDS: ELSEVIER SCIENCE BV, 2017, vol. 166, July, p. 140-146. ISSN 0927-0248. Available from: https://dx.doi.org/10.1016/j.solmat.2017.02.033.
Other formats:   BibTeX LaTeX RIS
Basic information
Original name Hafnium oxide thin films as a barrier against copper diffusion in solar absorbers
Authors KOTILAINEN, Minna Paula Katriina (246 Finland, belonging to the institution), Richard KRUMPOLEC (703 Slovakia, guarantor, belonging to the institution), Daniel FRANTA (203 Czech Republic, belonging to the institution), Pavel SOUČEK (203 Czech Republic, belonging to the institution), Tomáš HOMOLA (703 Slovakia, belonging to the institution), David Campbell CAMERON (826 United Kingdom of Great Britain and Northern Ireland, belonging to the institution) and Petri VUORISTO (246 Finland).
Edition Solar Energy Materials and Solar Cells, AMSTERDAM, NETHERLANDS, ELSEVIER SCIENCE BV, 2017, 0927-0248.
Other information
Original language English
Type of outcome Article in a journal
Field of Study 10302 Condensed matter physics
Country of publisher Netherlands
Confidentiality degree is not subject to a state or trade secret
WWW URL
Impact factor Impact factor: 5.018
RIV identification code RIV/00216224:14310/17:00096512
Organization unit Faculty of Science
Doi http://dx.doi.org/10.1016/j.solmat.2017.02.033
UT WoS 000401208200018
Keywords in English Solar absorber;Diffusion barrier;Thermal ageing;Copper diffusion;HfO2 thin film
Tags NZ, rivok
Changed by Changed by: Ing. Nicole Zrilić, učo 240776. Changed: 4/4/2018 13:29.
Abstract
The thermal stability of copper substrate material used in solar thermal collectors was investigated with and without atomic layer deposited (ALD) hafnium oxide barrier films at temperatures of 200–400 °C. HfO2 films were studied as barriers against thermal diffusion of copper substrate atoms. The ALD HfO2 thin films were deposited in a thermal process at 200 °C using Tetrakis(Dimethylamido)Hafnium(Hf(NMe2)4) and H2O precursors, with 200, 400, and 600 cycles. The Cu substrates with and without HfO2 thin films were aged by means of heat treatment in air. The influence of the HfO2 barriers was determined by optical, microstructural, and morphological analyses before and after the ageing procedures. The optical performance of the HfO2 barriers as a part of solar absorber stack was modelled with CODE Coating Designer. The copper surface without a HfO2 barrier thin film oxidized significantly, which increased thermal emittance and surface roughness. 200 cycles of HfO2 deposition did not result in a completely continuous coating and only provided a little protection against oxidation. Films of 200 and 400 cycles gave continuous coverage and the thickest HfO2 thin film studied, which was deposited from 600 ALD cycles and had a thickness ~50 nm, prevented Cu oxidation and diffusion processes after 2 h heat treatment in air at 300 °C, and retained low thermal emissivity. At 400 °C, diffusion and formation of copper oxide hillocks were observed but the HfO2 thin film significantly retarded the degradation when compared to a Cu substrate without and with thinner barrier layers.
Links
ED2.1.00/03.0086, research and development projectName: Regionální VaV centrum pro nízkonákladové plazmové a nanotechnologické povrchové úpravy
LO1411, research and development projectName: Rozvoj centra pro nízkonákladové plazmové a nanotechnologické povrchové úpravy (Acronym: CEPLANT plus)
Investor: Ministry of Education, Youth and Sports of the CR
PrintDisplayed: 15/5/2024 09:18