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@inproceedings{1406930,
author = {Kesner, Filip and Sekanina, Lukas and Brázdil, Milan},
address = {New York},
booktitle = {39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2017},
doi = {http://dx.doi.org/10.1109/EMBC.2017.8036851},
keywords = {detection of inter-ictal spikes in iEEG},
howpublished = {tištěná verze "print"},
language = {eng},
location = {New York},
isbn = {978-1-5090-2809-2},
pages = {418-421},
publisher = {IEEE},
title = {Modular framework for detection of inter-ictal spikes in iEEG},
year = {2017}
}
TY - JOUR
ID - 1406930
AU - Kesner, Filip - Sekanina, Lukas - Brázdil, Milan
PY - 2017
TI - Modular framework for detection of inter-ictal spikes in iEEG
PB - IEEE
CY - New York
SN - 9781509028092
KW - detection of inter-ictal spikes in iEEG
N2 - In this paper, we present a new modular approach for detection of inter-ictal spikes in intracranial iEEG recordings from patients that are suffering from pharmaco-resistant form of epilepsy. This new approach is presented in the form of a detection framework consisting of three primary modules: first level detector, second level feature extractor, and third level detection classifier, where each module is responsible for a specific functionality. This detection framework can be perceived as a three slot system, where modules can be easily plugged in their slots and replaced by a different module or implementation on demand, in order to adapt the quality of detection (measured in terms of sensitivity, precision or inter-recording adaptability) and computational cost. Using complex real-world data sets it was confirmed that the proposed framework provides highly sensitive and precise detection, while it also significantly reduces the computation time.
ER -
KESNER, Filip, Lukas SEKANINA a Milan BRÁZDIL. Modular framework for detection of inter-ictal spikes in iEEG. In \textit{39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2017}. New York: IEEE, 2017, s.~418-421. ISBN~978-1-5090-2809-2. Dostupné z: https://dx.doi.org/10.1109/EMBC.2017.8036851.
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