HNILICA, Jaroslav, Peter KLEIN, Petr VAŠINA, Rony SNYDERS and Nikolay BRITUN. Dynamics of sputtered particles in multipulse HiPIMS discharge. Plasma Sources Science and Technology. IOP Publishing Ltd, 2023, vol. 32, No 4, p. 1-12. ISSN 0963-0252. Available from: https://dx.doi.org/10.1088/1361-6595/acc686.
Other formats:   BibTeX LaTeX RIS
Basic information
Original name Dynamics of sputtered particles in multipulse HiPIMS discharge
Authors HNILICA, Jaroslav (203 Czech Republic, guarantor, belonging to the institution), Peter KLEIN (703 Slovakia, belonging to the institution), Petr VAŠINA (203 Czech Republic, belonging to the institution), Rony SNYDERS and Nikolay BRITUN.
Edition Plasma Sources Science and Technology, IOP Publishing Ltd, 2023, 0963-0252.
Other information
Original language English
Type of outcome Article in a journal
Field of Study 10305 Fluids and plasma physics
Country of publisher United Kingdom of Great Britain and Northern Ireland
Confidentiality degree is not subject to a state or trade secret
WWW URL
Impact factor Impact factor: 3.800 in 2022
RIV identification code RIV/00216224:14310/23:00130646
Organization unit Faculty of Science
Doi http://dx.doi.org/10.1088/1361-6595/acc686
UT WoS 000963848900001
Keywords in English sputtering; multipulse; HiPIMS; discharge; LIF; AAS
Tags rivok
Tags International impact, Reviewed
Changed by Changed by: Mgr. Marie Šípková, DiS., učo 437722. Changed: 29/2/2024 14:42.
Abstract
The behavior of the ground state neutral and singly ionized atoms is studied in multipulse high power impulse magnetron sputtering processes. The time-resolved two-dimensional laser induced fluorescence was used for imaging the discharge volume (density mapping) during the plasma-on and plasma-off time phases. The role of the number of micropulses and delay time between the micropulses in the pulse package is analyzed and discussed systematically. In addition, the propagation of the sputtered particles from the target is investigated.
Links
90239, large research infrastructuresName: CEPLANT II
PrintDisplayed: 31/8/2024 06:32