Detailed Information on Publication Record
2023
Correlative Theoretical and Experimental Study of the Polycarbonate | X Interfacial Bond Formation (X = AlN, TiN, (Ti,Al)N) During Magnetron Sputtering
PATTERER, Lena, Pavel ONDRAČKA, Dimitri BOGDANOVSKI, Stanislav MRÁZ, Soheil Karimi AGHDA et. al.Basic information
Original name
Correlative Theoretical and Experimental Study of the Polycarbonate | X Interfacial Bond Formation (X = AlN, TiN, (Ti,Al)N) During Magnetron Sputtering
Authors
PATTERER, Lena, Pavel ONDRAČKA (203 Czech Republic, belonging to the institution), Dimitri BOGDANOVSKI, Stanislav MRÁZ, Soheil Karimi AGHDA, Peter J. PÖLLMANN, Yu-Ping CHIEN and Jochen M. SCHNEIDER
Edition
Advanced Materials Interfaces, Wiley, 2023, 2196-7350
Other information
Language
English
Type of outcome
Článek v odborném periodiku
Field of Study
10305 Fluids and plasma physics
Country of publisher
United States of America
Confidentiality degree
není předmětem státního či obchodního tajemství
References:
Impact factor
Impact factor: 5.400 in 2022
RIV identification code
RIV/00216224:14310/23:00132448
Organization unit
Faculty of Science
UT WoS
001034367100001
Keywords in English
ab initio molecular dynamics; bonding analysis; density functional theory; polycarbonate; sputter deposition; (Ti; Al) N; X-ray photoelectron spectroscopy
Tags
Tags
International impact, Reviewed
Změněno: 21/2/2024 14:39, Mgr. Marie Šípková, DiS.
Abstract
V originále
To understand the interfacial bond formation between polycarbonate (PC) and magnetron-sputtered metal nitride thin films, PC | X interfaces (X = AlN, TiN, (Ti,Al)N) are comparatively investigated by ab initio simulations as well as X-ray photoelectron spectroscopy. The simulations predict significant differences at the interface as N and Ti form bonds with all functional groups of the polymer, while Al reacts selectively only with the carbonate group of pristine PC. In good agreement with simulations, experimental data reveal that the PC | AlN and the PC | (Ti,Al)N interfaces are mainly defined by interfacial C─N bonds, whereas for PC | TiN, the interface formation is also characterized by numerous C─Ti and (C─O)─Ti bonds. Bond strength calculations combined with the measured interfacial bond density indicate the strongest interface for PC | (Ti,Al)N followed by PC | AlN, whereas the weakest is predicted for PC | TiN due to its lower density of strong interfacial C─N bonds. This study shows that the employed computational strategy enables prediction of the interfacial bond formation between PC and metal nitrides and that it is reasonable to assume that the research strategy proposed herein can be readily adapted to other organic | inorganic interfaces.
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