J 2023

Correlative Theoretical and Experimental Study of the Polycarbonate | X Interfacial Bond Formation (X = AlN, TiN, (Ti,Al)N) During Magnetron Sputtering

PATTERER, Lena, Pavel ONDRAČKA, Dimitri BOGDANOVSKI, Stanislav MRÁZ, Soheil Karimi AGHDA et. al.

Basic information

Original name

Correlative Theoretical and Experimental Study of the Polycarbonate | X Interfacial Bond Formation (X = AlN, TiN, (Ti,Al)N) During Magnetron Sputtering

Authors

PATTERER, Lena, Pavel ONDRAČKA (203 Czech Republic, belonging to the institution), Dimitri BOGDANOVSKI, Stanislav MRÁZ, Soheil Karimi AGHDA, Peter J. PÖLLMANN, Yu-Ping CHIEN and Jochen M. SCHNEIDER

Edition

Advanced Materials Interfaces, Wiley, 2023, 2196-7350

Other information

Language

English

Type of outcome

Článek v odborném periodiku

Field of Study

10305 Fluids and plasma physics

Country of publisher

United States of America

Confidentiality degree

není předmětem státního či obchodního tajemství

References:

Impact factor

Impact factor: 5.400 in 2022

RIV identification code

RIV/00216224:14310/23:00132448

Organization unit

Faculty of Science

UT WoS

001034367100001

Keywords in English

ab initio molecular dynamics; bonding analysis; density functional theory; polycarbonate; sputter deposition; (Ti; Al) N; X-ray photoelectron spectroscopy

Tags

Tags

International impact, Reviewed
Změněno: 21/2/2024 14:39, Mgr. Marie Šípková, DiS.

Abstract

V originále

To understand the interfacial bond formation between polycarbonate (PC) and magnetron-sputtered metal nitride thin films, PC | X interfaces (X = AlN, TiN, (Ti,Al)N) are comparatively investigated by ab initio simulations as well as X-ray photoelectron spectroscopy. The simulations predict significant differences at the interface as N and Ti form bonds with all functional groups of the polymer, while Al reacts selectively only with the carbonate group of pristine PC. In good agreement with simulations, experimental data reveal that the PC | AlN and the PC | (Ti,Al)N interfaces are mainly defined by interfacial C─N bonds, whereas for PC | TiN, the interface formation is also characterized by numerous C─Ti and (C─O)─Ti bonds. Bond strength calculations combined with the measured interfacial bond density indicate the strongest interface for PC | (Ti,Al)N followed by PC | AlN, whereas the weakest is predicted for PC | TiN due to its lower density of strong interfacial C─N bonds. This study shows that the employed computational strategy enables prediction of the interfacial bond formation between PC and metal nitrides and that it is reasonable to assume that the research strategy proposed herein can be readily adapted to other organic | inorganic interfaces.

Links

90239, large research infrastructures
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