TRUNEC, David, Martin ŠÍRA, Pavel SŤAHEL, Vilma BURŠÍKOVÁ and Daniel FRANTA. Deposition of thin films at higher substrate temperatures in atmospheric pressure glow discharge. In 10th International Symposium on High Pressure Low Temperature Plasma Chemistry. Saga, Japan: Saga University, 2006, p. 331-334.
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Basic information
Original name Deposition of thin films at higher substrate temperatures in atmospheric pressure glow discharge
Name in Czech Depozice tenkých vrstev za vysších teplot substrátu v atmosférickém doutnavém výboji
Authors TRUNEC, David (203 Czech Republic, guarantor), Martin ŠÍRA (203 Czech Republic), Pavel SŤAHEL (203 Czech Republic), Vilma BURŠÍKOVÁ (203 Czech Republic) and Daniel FRANTA (203 Czech Republic).
Edition Saga, Japan, 10th International Symposium on High Pressure Low Temperature Plasma Chemistry, p. 331-334, 4 pp. 2006.
Publisher Saga University
Other information
Original language English
Type of outcome Proceedings paper
Field of Study 10305 Fluids and plasma physics
Country of publisher Japan
Confidentiality degree is not subject to a state or trade secret
RIV identification code RIV/00216224:14310/06:00016224
Organization unit Faculty of Science
Keywords in English thin films; glow discharge; atmospheric pressure
Tags atmospheric pressure, glow discharge, thin films
Tags International impact
Changed by Changed by: Mgr. Martin Šíra, Ph.D., učo 13705. Changed: 4/1/2007 12:06.
Abstract
The atmospheric pressure glow discharge was used for the deposition of thin organosilicon polymer films. The plasma was burning in pure nitrogen used as a carrier gas and a small admixture of organosilicons compounds such as hexamethyldisilazane (HMDSN) or hexamethyldisiloxane (HMDSO) was used as a monomer. The temperature of the substrate was elevated up to 120 degrees of Celsia to obtain harder thin films. The homogeneity of thin films was enhanced using movable upper electrode. Electrical measurements were used to distinguish between glow and filamentary regime. Mechanical properties of deposited films were characterised by depth sensing indentation technique. The films were polymer-like, transparent in visible range, with uniform thickness and without pinholes.
Abstract (in Czech)
Byly nadeponovány tenké organosilikonové vrstvy v atmosférickém doutnavém výboji. Plasma bylo zapáleno v dusíku s malou příměsí monomeru hexametyldisiloxanu (HMDSO). Aby byly dosaženy vyšší tvrdosri tenkých vrstev, byla teplota substrátu zvýšena až na 120 stupňů celsia. Homogenita tenkých vrstev byla zvýšena použitím pohyblivé horní elektrody. Pomocí měření elektrických veličin bylo ukázáno použití doutnavého režimu. Mechanické vlastnosti tenkých vrstev byly určeny indentačními technikami. Vrstvy byly transparentní ve viditelné oblasti spektra.
Links
GA202/06/1473, research and development projectName: Depozice tenkých vrstev v dielektrických bariérových výbojích za atmosférického tlaku
Investor: Czech Science Foundation, Deposition of thin films in dielectric barrier discharges at atmospheric pressure
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