Detailed Information on Publication Record
2007
Organosilicon thin films deposited by plasma enhanced CVD: Thermal changes of chemical structure and mechanical properties
ZAJÍČKOVÁ, Lenka, Vilma BURŠÍKOVÁ, Zuzana KUČEROVÁ, Jana FRANCLOVÁ, Pavel SŤAHEL et. al.Basic information
Original name
Organosilicon thin films deposited by plasma enhanced CVD: Thermal changes of chemical structure and mechanical properties
Name in Czech
Organosilikonové tenké vrstvy připravené metodou PECVD: termálně indukované změny chemické struktury a mechanických vlastností
Authors
ZAJÍČKOVÁ, Lenka (203 Czech Republic, guarantor), Vilma BURŠÍKOVÁ (203 Czech Republic), Zuzana KUČEROVÁ (203 Czech Republic), Jana FRANCLOVÁ (203 Czech Republic), Pavel SŤAHEL (203 Czech Republic), Vratislav PEŘINA (203 Czech Republic) and Anna MACKOVÁ (203 Czech Republic)
Edition
Journal of Physics and Chemistry of Solids, Elsevier, 2007, 0022-3697
Other information
Language
English
Type of outcome
Článek v odborném periodiku
Field of Study
10305 Fluids and plasma physics
Country of publisher
United States of America
Confidentiality degree
není předmětem státního či obchodního tajemství
Impact factor
Impact factor: 0.899
RIV identification code
RIV/00216224:14310/07:00022272
Organization unit
Faculty of Science
UT WoS
000247887800117
Keywords in English
Thin films;Organometallic compounds;Plasma deposition;Infrared spectroscopy;Mechanical properties
Tags
Tags
International impact, Reviewed
Změněno: 9/1/2008 09:46, doc. Mgr. Lenka Zajíčková, Ph.D.
V originále
Thin organosilicon and silicon oxide films were deposited in r.f. capacitively coupled discharges from a mixture of hexamethyldisiloxane (HMDSO) and oxygen. The concentration of HMDSO was in the range 5-17%. Even for such relatively high dilution of HMDSO the organic-inorganic crossover of the film character was observed due to changes of the HMDSO concentration, but other factors, such as pressure and d.c. self-bias should also be taken into account. When annealed the films changed their composition, chemical structure and mechanical properties. We observed desorption of water, methane and CO or CO2 from the SiO2-like films. The hardness of the SiO2-like film, containing 5% carbon and 25% hydrogen, increased with the increase of annealing temperature from 5.9 (as deposited) to 11.3 GPa (500 oC). Simultaneously, its fracture toughness was significantly improved. These effects were explained by dehydration and cross-linking of the film. However, the mechanical properties of highly cross-linked SiO1:9C1:6H0:6 plasma polymer were superior over the SiO2-like film containing impurities and such film can be used as a protective coating with a hardness above 9.6 GPa up to the temperature of 400 oC.
In Czech
Tenké organosilikonové vrstvy a vrstvy oxidu křemíku byly deponovány ve v.f. kapacitně vázaném výboji ze směsi HMDSO s kyslíkem
Links
| MSM0021622411, plan (intention) |
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| 1K05025, research and development project |
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