Detailed Information on Publication Record
2009
On the stability of Ag, Cu, and Sn nanoparticles
BROŽ, Pavel, Jiří SOPOUŠEK and Jan VŘEŠŤÁLBasic information
Original name
On the stability of Ag, Cu, and Sn nanoparticles
Name in Czech
Stabilita Ag, Cu, Sn nanočástic.
Name (in English)
On the stability of Ag, Cu, and Sn nanoparticles
Authors
BROŽ, Pavel (203 Czech Republic, guarantor, belonging to the institution), Jiří SOPOUŠEK (203 Czech Republic, belonging to the institution) and Jan VŘEŠŤÁL (203 Czech Republic, belonging to the institution)
Edition
CALPHAD XXXVIII (Praha, May 17-22, 2009), 2009
Other information
Language
Czech
Type of outcome
Konferenční abstrakt
Field of Study
10403 Physical chemistry
Country of publisher
Slovakia
Confidentiality degree
není předmětem státního či obchodního tajemství
RIV identification code
RIV/00216224:14310/09:00049590
Organization unit
Faculty of Science
Keywords (in Czech)
CALPHAD; termická analýza; nano; fázové diagramy
Keywords in English
CALPHAD; thermal analysis; nano; phase diagram
Tags
Tags
International impact
Změněno: 5/4/2012 10:34, Iva Klímová
V originále
Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected. In order to get new information in this field, stability of Ag, Cu and Sn nanopoparticles and surface effects as well as potential application for soldering technology were studied. DSC measurements by means of STA 409 CD/3/5/G apparatus from Netzsch, X-ray diffraction analysis on PANalytical X Pert PRO MPD device equipped with X Celerator detector and transmission electron microscopy (TEM) in a Philips CM12 STEM apparatus were basic methods used for experimental investigations. Experimental results were confronted with theoretical calculations based on the CALPHAD approach.
In English
Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected. In order to get new information in this field, stability of Ag, Cu and Sn nanopoparticles and surface effects as well as potential application for soldering technology were studied. DSC measurements by means of STA 409 CD/3/5/G apparatus from Netzsch, X-ray diffraction analysis on PANalytical X Pert PRO MPD device equipped with X Celerator detector and transmission electron microscopy (TEM) in a Philips CM12 STEM apparatus were basic methods used for experimental investigations. Experimental results were confronted with theoretical calculations based on the CALPHAD approach.
Links
| GA106/09/0700, research and development project |
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| OC09010, research and development project |
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