SOPOUŠEK, Jiří, Jiří BURŠÍK, Jakub ZÁLEŠÁK, Vilma BURŠÍKOVÁ and Pavel BROŽ. Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere. In TechConnect WORLD Conference & Expo 2010. Danville, CA 94526, U.S.A.: Nano Science and Technology Institute, 2010. p. 117-118. ISBN 978-1-4398-3421-3.
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Basic information
Original name Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere
Name in Czech Působení nanoprášku stříbra na měděný substrát
Authors SOPOUŠEK, Jiří (203 Czech Republic, guarantor, belonging to the institution), Jiří BURŠÍK (203 Czech Republic), Jakub ZÁLEŠÁK (203 Czech Republic), Vilma BURŠÍKOVÁ (203 Czech Republic, belonging to the institution) and Pavel BROŽ (203 Czech Republic, belonging to the institution).
Edition Danville, CA 94526, U.S.A. TechConnect WORLD Conference & Expo 2010, p. 117-118, 2010.
Publisher Nano Science and Technology Institute
Other information
Original language English
Type of outcome Proceedings paper
Field of Study 10403 Physical chemistry
Country of publisher United States of America
Confidentiality degree is not subject to a state or trade secret
Publication form electronic version available online
WWW Nanotech 2010 (Anaheim CA)
RIV identification code RIV/00216224:14310/10:00049625
Organization unit Faculty of Science
ISBN 978-1-4398-3421-3
Keywords in English Soldering nanopowder substrate characterisation
Tags AKb, CALPHAD, Nanopowder, rivok, silver, SUBSTRATE
Tags International impact
Changed by Changed by: prof. RNDr. Jiří Sopoušek, CSc., učo 2405. Changed: 24. 1. 2013 14:58.
Abstract
Sintering effect of Ag nanoparticles studied in this work seems to be an interesting alternative of lead-free soldering. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
Abstract (in Czech)
Byly nanočástice Ag, Sn a Cu a interakce Ag s Cu substrátem
Links
GA106/09/0700, research and development projectName: Termodynamika a mikrostruktura nanopráškových pájek šetrných k životnímu prostředí
Investor: Czech Science Foundation, Thermodynamics and microstructure of environmentally friendly nanoparticle solders
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