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@inproceedings{890032,
author = {Sopoušek, Jiří and Buršík, Jiří and Zálešák, Jakub and Buršíková, Vilma and Brož, Pavel},
address = {Danville, CA 94526, U.S.A.},
booktitle = {TechConnect WORLD Conference & Expo 2010},
keywords = {Soldering nanopowder substrate characterisation},
howpublished = {elektronická verze "online"},
language = {eng},
location = {Danville, CA 94526, U.S.A.},
isbn = {978-1-4398-3421-3},
pages = {117-118},
publisher = {Nano Science and Technology Institute},
title = {Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere},
url = {http://www.techconnectworld.com/Nanotech2010/},
year = {2010}
}
TY - JOUR
ID - 890032
AU - Sopoušek, Jiří - Buršík, Jiří - Zálešák, Jakub - Buršíková, Vilma - Brož, Pavel
PY - 2010
TI - Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere
PB - Nano Science and Technology Institute
CY - Danville, CA 94526, U.S.A.
SN - 9781439834213
KW - Soldering nanopowder substrate characterisation
UR - http://www.techconnectworld.com/Nanotech2010/
N2 - Sintering effect of Ag nanoparticles studied in this work seems to be an interesting alternative of lead-free soldering. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
ER -
SOPOUŠEK, Jiří, Jiří BURŠÍK, Jakub ZÁLEŠÁK, Vilma BURŠÍKOVÁ and Pavel BROŽ. Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere. In \textit{TechConnect WORLD Conference \&{} Expo 2010}. Danville, CA 94526, U.S.A.: Nano Science and Technology Institute, 2010. p.~117-118. ISBN~978-1-4398-3421-3.
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