| SOPOUŠEK, Jiří, Marian PALCUT, Erika HODÚLOVÁ and Josef JANOVEC. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. JOURNAL OF ELECTRONIC MATERIALS. NEW YORK: SPRINGER, 2010, vol. 39, No 3, p. 312-317. ISSN 0361-5235. Available from: https://dx.doi.org/10.1007/s11664-009-1070-2. |
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@article{901348,
author = {Sopoušek, Jiří and Palcut, Marian and Hodúlová, Erika and Janovec, Josef},
article_location = {NEW YORK},
article_number = {3},
doi = {http://dx.doi.org/10.1007/s11664-009-1070-2},
keywords = {Lead-free soldering; solidification; CALPHAD; DSC simulation},
language = {eng},
issn = {0361-5235},
journal = {JOURNAL OF ELECTRONIC MATERIALS},
title = {Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy},
url = {http://apps.isiknowledge.com/full_record.do?product=WOS&search_mode=GeneralSearch&qid=3&SID=Q13Jb6coJ8i9HGj142P&page=1&doc=2},
volume = {39},
year = {2010}
}
TY - JOUR
ID - 901348
AU - Sopoušek, Jiří - Palcut, Marian - Hodúlová, Erika - Janovec, Josef
PY - 2010
TI - Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy
JF - JOURNAL OF ELECTRONIC MATERIALS
VL - 39
IS - 3
SP - 312-317
EP - 312-317
PB - SPRINGER
SN - 03615235
KW - Lead-free soldering
KW - solidification
KW - CALPHAD
KW - DSC simulation
UR - http://apps.isiknowledge.com/full_record.do?product=WOS&search_mode=GeneralSearch&qid=3&SID=Q13Jb6coJ8i9HGj142P&page=1&doc=2
N2 - The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200A degrees C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.
ER -
SOPOUŠEK, Jiří, Marian PALCUT, Erika HODÚLOVÁ and Josef JANOVEC. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. \textit{JOURNAL OF ELECTRONIC MATERIALS}. NEW YORK: SPRINGER, 2010, vol.~39, No~3, p.~312-317. ISSN~0361-5235. Available from: https://dx.doi.org/10.1007/s11664-009-1070-2.
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