SOPOUŠEK, Jiří, Marian PALCUT, Erika HODÚLOVÁ and Josef JANOVEC. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. JOURNAL OF ELECTRONIC MATERIALS. NEW YORK: SPRINGER, 2010, vol. 39, No 3, p. 312-317. ISSN 0361-5235. Available from: https://dx.doi.org/10.1007/s11664-009-1070-2. |
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@article{901348, author = {Sopoušek, Jiří and Palcut, Marian and Hodúlová, Erika and Janovec, Josef}, article_location = {NEW YORK}, article_number = {3}, doi = {http://dx.doi.org/10.1007/s11664-009-1070-2}, keywords = {Lead-free soldering; solidification; CALPHAD; DSC simulation}, language = {eng}, issn = {0361-5235}, journal = {JOURNAL OF ELECTRONIC MATERIALS}, title = {Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy}, url = {http://apps.isiknowledge.com/full_record.do?product=WOS&search_mode=GeneralSearch&qid=3&SID=Q13Jb6coJ8i9HGj142P&page=1&doc=2}, volume = {39}, year = {2010} }
TY - JOUR ID - 901348 AU - Sopoušek, Jiří - Palcut, Marian - Hodúlová, Erika - Janovec, Josef PY - 2010 TI - Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy JF - JOURNAL OF ELECTRONIC MATERIALS VL - 39 IS - 3 SP - 312-317 EP - 312-317 PB - SPRINGER SN - 03615235 KW - Lead-free soldering KW - solidification KW - CALPHAD KW - DSC simulation UR - http://apps.isiknowledge.com/full_record.do?product=WOS&search_mode=GeneralSearch&qid=3&SID=Q13Jb6coJ8i9HGj142P&page=1&doc=2 N2 - The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200A degrees C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach. ER -
SOPOUŠEK, Jiří, Marian PALCUT, Erika HODÚLOVÁ and Josef JANOVEC. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. \textit{JOURNAL OF ELECTRONIC MATERIALS}. NEW YORK: SPRINGER, 2010, vol.~39, No~3, p.~312-317. ISSN~0361-5235. Available from: https://dx.doi.org/10.1007/s11664-009-1070-2.
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