SCHMIDTOVÁ, Tereza and Petr VAŠINA. Behaviour of Hybrid PVD-PECVD in Comparison with Conventional Reactive Magnetron Sputtering. In GEC/ICRP 2010. 2010. ISSN 0003-0503.
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Basic information
Original name Behaviour of Hybrid PVD-PECVD in Comparison with Conventional Reactive Magnetron Sputtering.
Name in Czech Chování hybridního PVD-PECVD procesu ve srovnání s tradičním reaktivním magnetronovým naprašováním.
Authors SCHMIDTOVÁ, Tereza (203 Czech Republic, belonging to the institution) and Petr VAŠINA (203 Czech Republic, guarantor, belonging to the institution).
Edition GEC/ICRP 2010, 2010.
Other information
Original language English
Type of outcome Conference abstract
Field of Study 10305 Fluids and plasma physics
Country of publisher France
Confidentiality degree is not subject to a state or trade secret
RIV identification code RIV/00216224:14310/10:00045789
Organization unit Faculty of Science
ISSN 0003-0503
Keywords (in Czech) magnetronové naprašování; hystereze; hybridní PVD-PECVD proces
Keywords in English magnetron sputtering; hysteresis; hybrid PVD-PECVD process
Changed by Changed by: Mgr. Tereza Schmidtová, Ph.D., učo 151253. Changed: 4/1/2011 09:48.
Abstract
Behaviour of Hybrid PVD-PECVD Process in Comparison with Conventional Reactive Magnetron Sputtering. Modelling of hybrid PVD-PECVd process.
Links
GD104/09/H080, research and development projectName: Plazmochemické procesy a jejich technologické aplikace
Investor: Czech Science Foundation
GP202/08/P038, research and development projectName: Studium chování hybridního depozičního procesu a jeho využití pro přípravu tenkých vrstev
Investor: Czech Science Foundation, Study of hybrid deposition process and its application for thin film deposition
MSM0021622411, plan (intention)Name: Studium a aplikace plazmochemických reakcí v neizotermickém nízkoteplotním plazmatu a jeho interakcí s povrchem pevných látek
Investor: Ministry of Education, Youth and Sports of the CR, Study and application of plasma chemical reactions in non-isothermic low temperature plasma and its interaction with solid surface
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