Effect of plasma treatment on the surface morphology and wettability of (111) and (100) silicon wafers

SKÁCELOVÁ, Dana, Martin HANIČINEC, Pavel SŤAHEL and Mirko ČERNÁK. Effect of plasma treatment on the surface morphology and wettability of (111) and (100) silicon wafers. 2011.

Basic information

• Original name: Effect of plasma treatment on the surface morphology and wettability of (111) and (100) silicon wafers
• Name in Czech: Efekt plazmové úpravy na morfologii a smáčivost povrchů křemíku (111) a (100)
• Authors: SKÁCELOVÁ, Dana (203 Czech Republic, guarantor), Martin HANIČINEC (203 Czech Republic, belonging to the institution), Pavel SŤAHEL (203 Czech Republic, belonging to the institution) and Mirko ČERNÁK (703 Slovakia, belonging to the institution).
• Edition: 2011.

Other information

• Original language: English
• Type of outcome: Conference abstract
• Field of Study: 10305 Fluids and plasma physics
• Country of publisher: Romania
• Confidentiality degree: is not subject to a state or trade secret
• RIV identification code: RIV/00216224:14310/11:00053531
• Organization unit: Faculty of Science
• Keywords (in Czech): Atmosférické plazma DCSBD krystalický křemík aktivace smáčivost
• Keywords in English: Atmospheric pressure plasma DCSBD crystalline silicon wafer plasma activation plasma etching wettability

Abstract

This paper is focused on the plasma treatment of silicon surface. The effect of plasma treatment in dependence of the different crystallographic orientation of silicon surface,(100) plane and (111) plane is compare

Links

• MSM0021622411, plan (intention): Name: Studium a aplikace plazmochemických reakcí v neizotermickém nízkoteplotním plazmatu a jeho interakcí s povrchem pevných látek

Investor: Ministry of Education, Youth and Sports of the CR, Study and application of plasma chemical reactions in non-isothermic low temperature plasma and its interaction with solid surface