HELFEN, L., A. MYAGOTIN, Petr MIKULÍK, P. PERNOT, A. VOROPAEV, M. ELYYAN, M. DI MICHIEL, J. BARUCHEL and T. BAUMBACH. On the implementation of computed laminography using synchrotron radiation. Review of Scientific Instruments. Melville (USA): American Institute of Physics, 2011, vol. 82, No 1, p. "nestrankovano", 8 pp. ISSN 0034-6748.
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Basic information
Original name On the implementation of computed laminography using synchrotron radiation
Authors HELFEN, L. (276 Germany), A. MYAGOTIN (643 Russian Federation), Petr MIKULÍK (203 Czech Republic, guarantor, belonging to the institution), P. PERNOT (203 Czech Republic), A. VOROPAEV (643 Russian Federation), M. ELYYAN (276 Germany), M. DI MICHIEL (380 Italy), J. BARUCHEL (250 France) and T. BAUMBACH (276 Germany).
Edition Review of Scientific Instruments, Melville (USA), American Institute of Physics, 2011, 0034-6748.
Other information
Original language English
Type of outcome Article in a journal
Field of Study 10302 Condensed matter physics
Country of publisher United States of America
Confidentiality degree is not subject to a state or trade secret
WWW URL
Impact factor Impact factor: 1.367
RIV identification code RIV/00216224:14310/11:00054740
Organization unit Faculty of Science
UT WoS 000292334000031
Keywords in English x-ray imaging; laminography; synchrotron radiation; radiography; CT
Tags AKR, rivok
Tags International impact, Reviewed
Changed by Changed by: Ing. Andrea Mikešková, učo 137293. Changed: 4/4/2012 16:16.
Abstract
Hard x rays from a synchrotron source are used in this implementation of computed laminography for three-dimensional (3D) imaging of flat, laterally extended objects. Due to outstanding properties of synchrotron light, high spatial resolution down to the micrometer scale can be attained, even for specimens having lateral dimensions of several decimeters. Operating either with a monochromatic or with a white synchrotron beam, the method can be optimized to attain high sensitivity or considerable inspection throughput in synchrotron user and small-batch industrial experiments. The article describes the details of experimental setups, alignment procedures, and the underlying reconstruction principles. Imaging of interconnections in flip-chip and wire-bonded devices illustrates the peculiarities of the method compared to its alternatives and demonstrates the wide application potential for the 3D inspection and quality assessment in microsystem technology.
Links
MSM0021622410, plan (intention)Name: Fyzikální a chemické vlastnosti pokročilých materiálů a struktur
Investor: Ministry of Education, Youth and Sports of the CR, Physical and chemical properties of advanced materials and structures
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