J 2011

On the implementation of computed laminography using synchrotron radiation

HELFEN, L., A. MYAGOTIN, Petr MIKULÍK, P. PERNOT, A. VOROPAEV et. al.

Basic information

Original name

On the implementation of computed laminography using synchrotron radiation

Authors

HELFEN, L. (276 Germany), A. MYAGOTIN (643 Russian Federation), Petr MIKULÍK (203 Czech Republic, guarantor, belonging to the institution), P. PERNOT (203 Czech Republic), A. VOROPAEV (643 Russian Federation), M. ELYYAN (276 Germany), M. DI MICHIEL (380 Italy), J. BARUCHEL (250 France) and T. BAUMBACH (276 Germany)

Edition

Review of Scientific Instruments, Melville (USA), American Institute of Physics, 2011, 0034-6748

Other information

Language

English

Type of outcome

Článek v odborném periodiku

Field of Study

10302 Condensed matter physics

Country of publisher

United States of America

Confidentiality degree

není předmětem státního či obchodního tajemství

References:

Impact factor

Impact factor: 1.367

RIV identification code

RIV/00216224:14310/11:00054740

Organization unit

Faculty of Science

UT WoS

000292334000031

Keywords in English

x-ray imaging; laminography; synchrotron radiation; radiography; CT

Tags

Tags

International impact, Reviewed
Změněno: 4/4/2012 16:16, Ing. Andrea Mikešková

Abstract

V originále

Hard x rays from a synchrotron source are used in this implementation of computed laminography for three-dimensional (3D) imaging of flat, laterally extended objects. Due to outstanding properties of synchrotron light, high spatial resolution down to the micrometer scale can be attained, even for specimens having lateral dimensions of several decimeters. Operating either with a monochromatic or with a white synchrotron beam, the method can be optimized to attain high sensitivity or considerable inspection throughput in synchrotron user and small-batch industrial experiments. The article describes the details of experimental setups, alignment procedures, and the underlying reconstruction principles. Imaging of interconnections in flip-chip and wire-bonded devices illustrates the peculiarities of the method compared to its alternatives and demonstrates the wide application potential for the 3D inspection and quality assessment in microsystem technology.

Links

MSM0021622410, plan (intention)
Name: Fyzikální a chemické vlastnosti pokročilých materiálů a struktur
Investor: Ministry of Education, Youth and Sports of the CR, Physical and chemical properties of advanced materials and structures