Detailed Information on Publication Record
2011
On the implementation of computed laminography using synchrotron radiation
HELFEN, L., A. MYAGOTIN, Petr MIKULÍK, P. PERNOT, A. VOROPAEV et. al.Basic information
Original name
On the implementation of computed laminography using synchrotron radiation
Authors
HELFEN, L. (276 Germany), A. MYAGOTIN (643 Russian Federation), Petr MIKULÍK (203 Czech Republic, guarantor, belonging to the institution), P. PERNOT (203 Czech Republic), A. VOROPAEV (643 Russian Federation), M. ELYYAN (276 Germany), M. DI MICHIEL (380 Italy), J. BARUCHEL (250 France) and T. BAUMBACH (276 Germany)
Edition
Review of Scientific Instruments, Melville (USA), American Institute of Physics, 2011, 0034-6748
Other information
Language
English
Type of outcome
Článek v odborném periodiku
Field of Study
10302 Condensed matter physics
Country of publisher
United States of America
Confidentiality degree
není předmětem státního či obchodního tajemství
References:
Impact factor
Impact factor: 1.367
RIV identification code
RIV/00216224:14310/11:00054740
Organization unit
Faculty of Science
UT WoS
000292334000031
Keywords in English
x-ray imaging; laminography; synchrotron radiation; radiography; CT
Tags
International impact, Reviewed
Změněno: 4/4/2012 16:16, Ing. Andrea Mikešková
Abstract
V originále
Hard x rays from a synchrotron source are used in this implementation of computed laminography for three-dimensional (3D) imaging of flat, laterally extended objects. Due to outstanding properties of synchrotron light, high spatial resolution down to the micrometer scale can be attained, even for specimens having lateral dimensions of several decimeters. Operating either with a monochromatic or with a white synchrotron beam, the method can be optimized to attain high sensitivity or considerable inspection throughput in synchrotron user and small-batch industrial experiments. The article describes the details of experimental setups, alignment procedures, and the underlying reconstruction principles. Imaging of interconnections in flip-chip and wire-bonded devices illustrates the peculiarities of the method compared to its alternatives and demonstrates the wide application potential for the 3D inspection and quality assessment in microsystem technology.
Links
MSM0021622410, plan (intention) |
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