BURŠÍK, Jiří, Jiří SOPOUŠEK, Vilma BURŠÍKOVÁ and Jakub ZÁLEŠÁK. Microstructure and local mechanical properties of model joints with Pb-free nanopowders. In Tanger, s.r.o. NANOCON 2009, 20.-22.10.2009. Ostrava: Tanger, s.r.o., 2009. p. 1-4. ISBN 978-80-87294-12-3.
Other formats:   BibTeX LaTeX RIS
Basic information
Original name Microstructure and local mechanical properties of model joints with Pb-free nanopowders
Name in Czech Mikrostruktura a lokální mechanické vlastnosti modelových spojů nanoprášků bez olova
Name (in English) Microstructure and local mechanical properties of model joints with Pb-free nanopowders
Authors BURŠÍK, Jiří (203 Czech Republic), Jiří SOPOUŠEK (203 Czech Republic, belonging to the institution), Vilma BURŠÍKOVÁ (203 Czech Republic, guarantor, belonging to the institution) and Jakub ZÁLEŠÁK (203 Czech Republic, belonging to the institution).
Edition Ostrava, NANOCON 2009, 20.-22.10.2009, p. 1-4, 4 pp. 2009.
Publisher Tanger, s.r.o.
Other information
Original language Czech
Type of outcome Proceedings paper
Field of Study 10403 Physical chemistry
Country of publisher Czech Republic
Confidentiality degree is not subject to a state or trade secret
Publication form printed version "print"
RIV identification code RIV/00216224:14310/09:00050398
Organization unit Faculty of Science
ISBN 978-80-87294-12-3
Keywords (in Czech) Nano Stříbro měď
Keywords in English Nano Silver copper
Tags IK, rivok
Changed by Changed by: prof. RNDr. Jiří Sopoušek, CSc., učo 2405. Changed: 24. 1. 2013 15:00.
Abstract
Contribution of Microstructure and local mechanical properties of model joints with Pb-free nanopowders and other investigations
Abstract (in English)
Contribution of Microstructure and local mechanical properties of model joints with Pb-free nanopowders and other investigations
Links
GA106/09/0700, research and development projectName: Termodynamika a mikrostruktura nanopráškových pájek šetrných k životnímu prostředí
Investor: Czech Science Foundation, Thermodynamics and microstructure of environmentally friendly nanoparticle solders
PrintDisplayed: 27. 6. 2022 01:51