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@article{1160203,
author = {Pešina, Zbyněk and Vykoukal, Vít and Palcut, Marian and Sopoušek, Jiří},
article_location = {South Korea},
article_number = {1},
doi = {http://dx.doi.org/10.1007/s13391-013-3148-5},
keywords = {Ag; Cu; pevnost ve smyku; zkouška; nanočástice;},
language = {eng},
issn = {1738-8090},
journal = {Electronic Materials Letters},
title = {Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles},
url = {http://link.springer.com/article/10.1007%2Fs13391-013-3148-5#},
volume = {10},
year = {2014}
}
TY - JOUR
ID - 1160203
AU - Pešina, Zbyněk - Vykoukal, Vít - Palcut, Marian - Sopoušek, Jiří
PY - 2014
TI - Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles
JF - Electronic Materials Letters
VL - 10
IS - 1
SP - 293-298
EP - 293-298
PB - Korean Inst Metals Materials
SN - 17388090
KW - Ag
KW - Cu
KW - pevnost ve smyku
KW - zkouška
KW - nanočástice;
UR - http://link.springer.com/article/10.1007%2Fs13391-013-3148-5#
L2 - http://link.springer.com/article/10.1007%2Fs13391-013-3148-5#
N2 - In this work, mechanical properties of Cu-to-Cu joint samples prepared by low temperature sintering of Ag nanoparticle paste have been investigated. The silver nanopaste was prepared by a controlled thermal decomposition of an organometallic precursor. The as-synthesized Ag particles were spherical, with an average diameter of 8.5 nm. The Cu-to-Cu joint samples were made by placing a small amount of Ag nanopaste between two polished Cu plates and sintering at 150C, 200C, 220C and 350C in air. A normal load was applied to aid sintering. Mechanical properties were measured by imposing a uniform stress across the sample bond area and measuring the corresponding strain. The application of external load was found to have a positive effect on the material’s mechanical properties. Furthermore, interestingly high values of shear strength were observed.
ER -
PEŠINA, Zbyněk, Vít VYKOUKAL, Marian PALCUT a Jiří SOPOUŠEK. Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles. \textit{Electronic Materials Letters}. South Korea: Korean Inst Metals Materials, 2014, roč.~10, č.~1, s.~293-298. ISSN~1738-8090. Dostupné z: https://dx.doi.org/10.1007/s13391-013-3148-5.
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