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@article{1160203, author = {Pešina, Zbyněk and Vykoukal, Vít and Palcut, Marian and Sopoušek, Jiří}, article_location = {South Korea}, article_number = {1}, doi = {http://dx.doi.org/10.1007/s13391-013-3148-5}, keywords = {Ag; Cu; pevnost ve smyku; zkouška; nanočástice;}, language = {eng}, issn = {1738-8090}, journal = {Electronic Materials Letters}, title = {Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles}, url = {http://link.springer.com/article/10.1007%2Fs13391-013-3148-5#}, volume = {10}, year = {2014} }
TY - JOUR ID - 1160203 AU - Pešina, Zbyněk - Vykoukal, Vít - Palcut, Marian - Sopoušek, Jiří PY - 2014 TI - Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles JF - Electronic Materials Letters VL - 10 IS - 1 SP - 293-298 EP - 293-298 PB - Korean Inst Metals Materials SN - 17388090 KW - Ag KW - Cu KW - pevnost ve smyku KW - zkouška KW - nanočástice; UR - http://link.springer.com/article/10.1007%2Fs13391-013-3148-5# L2 - http://link.springer.com/article/10.1007%2Fs13391-013-3148-5# N2 - In this work, mechanical properties of Cu-to-Cu joint samples prepared by low temperature sintering of Ag nanoparticle paste have been investigated. The silver nanopaste was prepared by a controlled thermal decomposition of an organometallic precursor. The as-synthesized Ag particles were spherical, with an average diameter of 8.5 nm. The Cu-to-Cu joint samples were made by placing a small amount of Ag nanopaste between two polished Cu plates and sintering at 150C, 200C, 220C and 350C in air. A normal load was applied to aid sintering. Mechanical properties were measured by imposing a uniform stress across the sample bond area and measuring the corresponding strain. The application of external load was found to have a positive effect on the material’s mechanical properties. Furthermore, interestingly high values of shear strength were observed. ER -
PEŠINA, Zbyněk, Vít VYKOUKAL, Marian PALCUT a Jiří SOPOUŠEK. Shear Strength of Copper Joints Prepared by Low Temperature Sintering of Silver Nanoparticles. \textit{Electronic Materials Letters}. South Korea: Korean Inst Metals Materials, 2014, roč.~10, č.~1, s.~293-298. ISSN~1738-8090. Dostupné z: https://dx.doi.org/10.1007/s13391-013-3148-5.
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