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@article{1297959, author = {Roshanghias, Ali and Vřešťál, Jan and Yakymovych, Andriy and Richter, Klaus W. and Ipser, Herbert}, article_location = {Oxford}, article_number = {june}, doi = {http://dx.doi.org/10.1016/j.calphad.2015.04.003}, keywords = {Nanoparticles; CALPHAD; Lead free solders; Size effect; Melting point depression}, language = {eng}, issn = {0364-5916}, journal = {CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY}, title = {Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system}, url = {http://ac.els-cdn.com/S0364591615001479/1-s2.0-S0364591615001479-main.pdf?_tid=657b9396-18d2-11e5-a5b4-00000aab0f6c&acdnat=1434972943_51946036303a7bbe672f61c386e8c474}, volume = {49}, year = {2015} }
TY - JOUR ID - 1297959 AU - Roshanghias, Ali - Vřešťál, Jan - Yakymovych, Andriy - Richter, Klaus W. - Ipser, Herbert PY - 2015 TI - Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system JF - CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY VL - 49 IS - june SP - 101-109 EP - 101-109 PB - PERGAMON-ELSEVIER SCIENCE LTD SN - 03645916 KW - Nanoparticles KW - CALPHAD KW - Lead free solders KW - Size effect KW - Melting point depression UR - http://ac.els-cdn.com/S0364591615001479/1-s2.0-S0364591615001479-main.pdf?_tid=657b9396-18d2-11e5-a5b4-00000aab0f6c&acdnat=1434972943_51946036303a7bbe672f61c386e8c474 L2 - http://ac.els-cdn.com/S0364591615001479/1-s2.0-S0364591615001479-main.pdf?_tid=657b9396-18d2-11e5-a5b4-00000aab0f6c&acdnat=1434972943_51946036303a7bbe672f61c386e8c474 N2 - Melting temperatures of Sn-Ag-Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature have received increasing attention. Recently, the phase stability of nanoparticles has been the subject of plenty of theoretical and empirical investigations. In the present study, SAC nanoparticles of various sizes have been synthesized via chemical reduction and the size dependent melting point depression of these particles has been specified experimentally. The liquidus projection in the Sn-rich corner of the ternary SAC system has also been calculated as a function of particle size, based on the CALPHAD-approach. The calculated melting temperatures were compared with those obtained experimentally and with values reported in the literature, which revealed good agreement. The model also predicts that with decreasing particle size, the eutectic composition shifts towards the Sn-rich corner. ER -
ROSHANGHIAS, Ali, Jan VŘEŠŤÁL, Andriy YAKYMOVYCH, Klaus W. RICHTER a Herbert IPSER. Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system. \textit{CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY}. Oxford: PERGAMON-ELSEVIER SCIENCE LTD, 2015, roč.~49, june, s.~101-109. ISSN~0364-5916. Dostupné z: https://dx.doi.org/10.1016/j.calphad.2015.04.003.
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