2022
Bond formation at polycarbonate | X interfaces (X = Ti, Al, TiAl) probed by X-ray photoelectron spectroscopy and density functional theory molecular dynamics simulations
PATTERER, Lena, Pavel ONDRAČKA, Dimitri BOGDANOVSKI, Leonie JENDE, Stephan PRUENTE et. al.Základní údaje
Originální název
Bond formation at polycarbonate | X interfaces (X = Ti, Al, TiAl) probed by X-ray photoelectron spectroscopy and density functional theory molecular dynamics simulations
Autoři
PATTERER, Lena, Pavel ONDRAČKA, Dimitri BOGDANOVSKI, Leonie JENDE, Stephan PRUENTE, Stanislav MRAZ, Soheil Karimi AGHDA, Bastian STELZER, Markus MOMMA a Jochen M SCHNEIDER
Vydání
Applied Surface Science, AMSTERDAM, Elsevier Science BV, 2022, 0169-4332
Další údaje
Typ výsledku
Článek v odborném periodiku
Utajení
není předmětem státního či obchodního tajemství
Impakt faktor
Impact factor: 6.700
UT WoS
000796201900001
Klíčová slova anglicky
Polycarbonate; Sputter deposition; Interfacial bonding analysis; XPS; DFT; Molecular dynamics
Štítky
Změněno: 12. 7. 2023 07:25, Mgr. Pavel Ondračka, Ph.D.
Anotace
V originále
To investigate the bond formation at polycarbonate (PC) | X interfaces (X = Ti, Al, TiAl) by X-ray photoelectron spectroscopy, thin metallic layers were deposited onto PC substrates by direct current magnetron sputtering. Additionally, changes in the chemical state of the polymer were studied systematically by density functional theory molecular dynamics simulations of a PC dimer interacting with the corresponding metallic surfaces. These predictions were confirmed by experiments, indicating a higher reactivity at PC | Ti interfaces: Ti reacts with all functional groups of PC, forming numerous interfacial C-Ti and (C-O)-Ti bonds, whereas Al exhibits selective reactivity as only (C-O)-Al bonds with the carbonate group are formed. However, integrated crystal orbital Hamilton population (ICOHP) calculations indicate a significantly higher interfacial bond strength for (C-O)- Al bonds compared to (C-O)-Ti and C-Ti bonds (ICOHP differences up to 3.1 eV). By multiplying the experimentally determined relative interfacial bond concentration with the theoretically determined maximum bond strength as an indicator for adhesion, the PC | Ti interface exhibits a -1.9 and -1.4 times larger value compared to the PC | Al and the PC | TiAl interface, respectively. Thus, Ti thin films are the preferential choice as adhesion layers for PC.