| BURŠÍKOVÁ, Vilma, Lenka ZAJÍČKOVÁ, Pavel DVOŘÁK, Deepak Prasad SUBEDI a Jan JANČA. Plasma enhanced chemical vapor deposition of silicon incorporated diamond-like carbon films. In Abstracts of Invited Lecturers and Contributed Papers ,XVth Europhysics Conference on Atomic and Molecular Physics of Ionized Gases. Miskolc - Lillafüred, Hungary: European Physical Society, 2000, s. 408-409. |
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@inproceedings{357856,
author = {Buršíková, Vilma and Zajíčková, Lenka and Dvořák, Pavel and Subedi, Deepak Prasad and Janča, Jan},
address = {Miskolc - Lillafüred, Hungary},
booktitle = {Abstracts of Invited Lecturers and Contributed Papers ,XVth Europhysics Conference on Atomic and Molecular Physics of Ionized Gases},
keywords = {PECVD; Diamond-like Carbon; Protective thin films; Silicon doping;},
language = {eng},
location = {Miskolc - Lillafüred, Hungary},
pages = {408-409},
publisher = {European Physical Society},
title = {Plasma enhanced chemical vapor deposition of silicon incorporated diamond-like carbon films},
year = {2000}
}
TY - JOUR
ID - 357856
AU - Buršíková, Vilma - Zajíčková, Lenka - Dvořák, Pavel - Subedi, Deepak Prasad - Janča, Jan
PY - 2000
TI - Plasma enhanced chemical vapor deposition of silicon incorporated diamond-like carbon films
PB - European Physical Society
CY - Miskolc - Lillafüred, Hungary
KW - PECVD
KW - Diamond-like Carbon
KW - Protective thin films
KW - Silicon doping;
N2 - Deposition of diamond like films with an incorporation of silicon by plasma enhanced CVD technique from mixture of methane, argon and hexamethyldisiloxane (HMDSO). Study of the influence of the percentage of HMDSO in the mixture on film properties.
ER -
BURŠÍKOVÁ, Vilma, Lenka ZAJÍČKOVÁ, Pavel DVOŘÁK, Deepak Prasad SUBEDI a Jan JANČA. Plasma enhanced chemical vapor deposition of silicon incorporated diamond-like carbon films. In \textit{Abstracts of Invited Lecturers and Contributed Papers ,XVth Europhysics Conference on Atomic and Molecular Physics of Ionized Gases}. Miskolc - Lillafüred, Hungary: European Physical Society, 2000, s.~408-409.
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