KLÍMA, Miloš, Jan JANČA, Vratislav KAPIČKA, Pavel SLAVÍČEK and Petr SAUL. The method of making a physically and chemically active environment by means of a plasma jet and the related plasma jet. 2003.
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Basic information
Original name The method of making a physically and chemically active environment by means of a plasma jet and the related plasma jet
Name in Czech Způsob vytváření fyzikálně a chemicky aktivního prostředí plazmovou tryskou a plazmová tryska
Authors KLÍMA, Miloš (203 Czech Republic, guarantor), Jan JANČA (203 Czech Republic), Vratislav KAPIČKA (203 Czech Republic), Pavel SLAVÍČEK (203 Czech Republic) and Petr SAUL (203 Czech Republic).
Edition Number: US 6,525,481, Publisher: Unides States Patent, Place of publication: USA, Owner's name: Masarykova univerzita, 2003.
Other information
Original language English
Type of outcome Patent
Field of Study 10305 Fluids and plasma physics
Country of publisher Germany
Confidentiality degree is not subject to a state or trade secret
RIV identification code RIV/00216224:14310/03:00024549
Organization unit Faculty of Science
Keywords in English hollow electrodes; hollow cathodes; plasma jet; discharges; plasma pencil; atmospheric pressure; high pressure; liquids
Tags atmospheric pressure, discharges, high pressure, hollow cathodes, hollow electrodes, liquids, plasma jet, plasma pencil
Changed by Changed by: Mgr. Miloš Klíma, Ph.D., učo 1606. Changed: 22/3/2006 15:21.
Abstract
patent - plasma pencil
Abstract (in Czech)
patent - plazmová tužka
Links
GA202/00/D057, research and development projectName: Studium procesů a aplikace plazmové tužky v kapalném prostředí
Investor: Czech Science Foundation, Study of processes and application of plasma pencil in fluid environment
MSM 143100003, plan (intention)Name: Studium plazmochemických reakcí v neizotermickém nízkoteplotním plazmatu a jeho interakcí s povrchem pevných látek
Investor: Ministry of Education, Youth and Sports of the CR, Study of plasmachemical reactions in non-isothermic low pressure plasma and its interaction with the surface of solid substrates
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