Detailed Information on Publication Record
2011
Interaction of Silver Nanopowder with Copper Substrate
SOPOUŠEK, Jiří, Jiří BURŠÍK, Jakub ZÁLEŠÁK, Vilma BURŠÍKOVÁ, Pavel BROŽ et. al.Basic information
Original name
Interaction of Silver Nanopowder with Copper Substrate
Name in Czech
Interakce nanoprášku stříbra se substrátem mědi
Authors
SOPOUŠEK, Jiří (203 Czech Republic, guarantor, belonging to the institution), Jiří BURŠÍK (203 Czech Republic), Jakub ZÁLEŠÁK (203 Czech Republic, belonging to the institution), Vilma BURŠÍKOVÁ (203 Czech Republic, belonging to the institution) and Pavel BROŽ (203 Czech Republic, belonging to the institution)
Edition
SCIENCE OF SINTERING, Beograd, International Institute for the Science of Sintering, 2011, 0350-820X
Other information
Language
English
Type of outcome
Článek v odborném periodiku
Field of Study
10403 Physical chemistry
Country of publisher
Serbia
Confidentiality degree
není předmětem státního či obchodního tajemství
References:
Impact factor
Impact factor: 0.274
RIV identification code
RIV/00216224:14310/11:00050088
Organization unit
Faculty of Science
UT WoS
000294191600004
Keywords (in Czech)
Sintrování DSC Indentace tání částice teplota cín
Keywords in English
Silver Copper Sintering DSC Indentation MELTING POINT PARTICLES TEMPERATURE TIN
Tags
International impact, Reviewed
Změněno: 8/2/2018 09:56, prof. RNDr. Jiří Sopoušek, CSc.
V originále
Addition of lead into tin based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
In Czech
Práce se zabývá alternativou pájení za použití nanočástic stříbra, pozornost je věnována interakci s mědí, která je nejčastěji spojovaným materiálem v elektronice.
Links
| GA106/09/0700, research and development project |
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| MUNI/A/0980/2009, interní kód MU |
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