| SOPOUŠEK, Jiří, Jiří BURŠÍK, Jakub ZÁLEŠÁK, Vilma BURŠÍKOVÁ a Pavel BROŽ. Interaction of Silver Nanopowder with Copper Substrate. SCIENCE OF SINTERING. Beograd: International Institute for the Science of Sintering, 2011, roč. 43, č. 1, s. 34-38. ISSN 0350-820X. |
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@article{955085,
author = {Sopoušek, Jiří and Buršík, Jiří and Zálešák, Jakub and Buršíková, Vilma and Brož, Pavel},
article_location = {Beograd},
article_number = {1},
keywords = {Silver Copper Sintering DSC Indentation MELTING POINT PARTICLES TEMPERATURE TIN},
language = {eng},
issn = {0350-820X},
journal = {SCIENCE OF SINTERING},
title = {Interaction of Silver Nanopowder with Copper Substrate},
url = {http://www.iiss.sanu.ac.rs/},
volume = {43},
year = {2011}
}
TY - JOUR
ID - 955085
AU - Sopoušek, Jiří - Buršík, Jiří - Zálešák, Jakub - Buršíková, Vilma - Brož, Pavel
PY - 2011
TI - Interaction of Silver Nanopowder with Copper Substrate
JF - SCIENCE OF SINTERING
VL - 43
IS - 1
SP - 34-38
EP - 34-38
PB - International Institute for the Science of Sintering
SN - 0350820X
KW - Silver Copper Sintering DSC Indentation MELTING POINT PARTICLES TEMPERATURE TIN
UR - http://www.iiss.sanu.ac.rs/
N2 - Addition of lead into tin based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
ER -
SOPOUŠEK, Jiří, Jiří BURŠÍK, Jakub ZÁLEŠÁK, Vilma BURŠÍKOVÁ a Pavel BROŽ. Interaction of Silver Nanopowder with Copper Substrate. \textit{SCIENCE OF SINTERING}. Beograd: International Institute for the Science of Sintering, 2011, roč.~43, č.~1, s.~34-38. ISSN~0350-820X.
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