Monitoring and control of RF driven PVD, PECVD and etching
plasmas using Fourier components of discharge voltages

a 2012

Monitoring and control of RF driven PVD, PECVD and etching plasmas using Fourier components of discharge voltages

VAŠINA, Petr; Pavel DVOŘÁK; Radek ŽEMLIČKA; Peter KLEIN; Vilma BURŠÍKOVÁ et al.

Základní údaje

Originální název

Monitoring and control of RF driven PVD, PECVD and etching plasmas using Fourier components of discharge voltages

Autoři

VAŠINA, Petr; Pavel DVOŘÁK; Radek ŽEMLIČKA; Peter KLEIN a Vilma BURŠÍKOVÁ

Vydání

Thirteenth International Conference on Plasma Surface Engineering, 2012

Další údaje

Jazyk

angličtina

Typ výsledku

Konferenční abstrakt

Obor

10305 Fluids and plasma physics

Stát vydavatele

Německo

Utajení

není předmětem státního či obchodního tajemství

Označené pro přenos do RIV

Ano

Kód RIV

RIV/00216224:14310/12:00057727

Organizační jednotka

Přírodovědecká fakulta

Klíčová slova anglicky

reactive magnetron sputtering; PECVD; process monitoring and control; higher harmonics

Štítky

AKR, rivok

Změněno: 23. 4. 2013 09:29, Ing. Andrea Mikešková

Anotace

V originále

PVD and PECVD require monitoring and control of the deposition process in order to reproducibly prepare coatings of desired quality. RF driven magnetron sputtering as well as RF driven PECVD processes use capacitively coupled plasma to deposit various types of thin films. Due to the nonlinearity of sheaths, higher harmonics of discharge voltage and current are produced in capacitive discharges. Since the sheaths are in contact with bulk plasma, higher harmonics are strong in particular when their frequencies are close to the series plasma–sheath resonance. Also, the harmonics are strong when they are not damped by collisions between electrons and neutrals. Both conditions are fulfilled at pressures typically below 10 Pa used in majority of PVD and PECVD applications. Fourier components of discharge voltages were measured in two different reactive plasmas and their response to creation or destruction of a thin film was studied. In reactive magnetron sputtering the effect of transition from the metallic to the compound mode accompanied by the creation of a compound film on the sputtered target was observed. The amplitudes of certain harmonics change almost one order of magnitude during the transitions from the metallic to the compound mode and vice versa, thus react with the similar sensitivity as OES on the changes in the deposition process. Further, deposition and etching of a diamond-like carbon film and their effects on amplitudes of Fourier components of the discharge voltage were studied. It was shown that the Fourier components, including higher harmonic frequencies, sensitively react to the presence of a film. Therefore, they can be used as a powerful tool for the monitoring of deposition and etching processes. The behavior of the Fourier components can be explained by the difference between the coefficients of secondary electron emission of the film and its underlying material in both experiments.

Návaznosti

ED2.1.00/03.0086, projekt VaV

Název: Regionální VaV centrum pro nízkonákladové plazmové a nanotechnologické povrchové úpravy

GAP205/12/0407, projekt VaV

Název: Porozumění hybridnímu PVD-PECVD procesu s cílem řídit růst nanostrukturovaných kompozitních vrstev

Investor: Grantová agentura ČR, Porozumění hybridnímu PVD-PECVD procesu s cílem řídit růst nanostrukturovaných kompozitních vrstev

GD104/09/H080, projekt VaV

Název: Plazmochemické procesy a jejich technologické aplikace

Investor: Grantová agentura ČR, Plazmochemické procesy a jejich technologické aplikace

Citovat

VAŠINA, Petr; Pavel DVOŘÁK; Radek ŽEMLIČKA; Peter KLEIN a Vilma BURŠÍKOVÁ. Monitoring and control of RF driven PVD, PECVD and etching plasmas using Fourier components of discharge voltages. In Thirteenth International Conference on Plasma Surface Engineering. 2012.

@proceedings{1070546,
   author = {Vašina, Petr and Dvořák, Pavel and Žemlička, Radek and Klein, Peter and Buršíková, Vilma},
   booktitle = {Thirteenth International Conference on Plasma Surface Engineering},
   keywords = {reactive magnetron sputtering; PECVD; process monitoring and control; higher harmonics},
   language = {eng},
   title = {Monitoring and control of RF driven PVD, PECVD and etching plasmas using Fourier components of discharge voltages},
   year = {2012}
}

TY  - CONF
ID  - 1070546
AU  - Vašina, Petr - Dvořák, Pavel - Žemlička, Radek - Klein, Peter - Buršíková, Vilma
PY  - 2012
TI  - Monitoring and control of RF driven PVD, PECVD and etching plasmas using Fourier components of discharge voltages
KW  - reactive magnetron sputtering
KW  - PECVD
KW  - process monitoring and control
KW  - higher harmonics
N2  - PVD and PECVD require monitoring and control of the deposition process in order to reproducibly prepare coatings of desired quality. RF driven magnetron sputtering as well as RF driven PECVD processes use capacitively coupled plasma to deposit various types of thin films. Due to the nonlinearity of sheaths, higher harmonics of discharge voltage and current are produced in capacitive discharges. Since the sheaths are in contact with bulk plasma, higher harmonics are strong in particular when their frequencies are close to the series plasma–sheath resonance. Also, the harmonics are strong when they are not damped by collisions between electrons and neutrals. Both conditions are fulfilled at pressures typically below 10 Pa used in majority of PVD and PECVD applications. Fourier components of discharge voltages were measured in two different reactive plasmas and their response to creation or destruction of a thin film was studied. In reactive magnetron sputtering the effect of transition from the metallic to the compound mode accompanied by the creation of a compound film on the sputtered target was observed. The amplitudes of certain harmonics change almost one order of magnitude during the transitions from the metallic to the compound mode and vice versa, thus react with the similar sensitivity as OES on the changes in the deposition process. Further, deposition and etching of a diamond-like carbon film and their effects on amplitudes of Fourier components of the discharge voltage were studied. It was shown that the Fourier components, including higher harmonic frequencies, sensitively react to the presence of a film. Therefore, they can be used as a powerful tool for the monitoring of deposition and etching processes. The behavior of the Fourier components can be explained by the difference between the coefficients of secondary electron emission of the film and its underlying material in both experiments.
ER  -

VAŠINA, Petr; Pavel DVOŘÁK; Radek ŽEMLIČKA; Peter KLEIN a Vilma BURŠÍKOVÁ. Monitoring and control of RF driven PVD, PECVD and etching plasmas using Fourier components of discharge voltages. In \textit{Thirteenth International Conference on Plasma Surface Engineering}. 2012.

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