BURŠÍK, Jiří, Vilma BURŠÍKOVÁ, Zbyněk PEŠINA a Jiří SOPOUŠEK. MECHANICAL PROPERTIES AND MICROSTRUCTURE OF MODEL LEAD-FREE JOINTS FOR ELECTRONICS MADE WITH USE OF NANOPOWDERS. Chemické listy. 2012, roč. 106, č. 3, s. 390-392. ISSN 1213-7103. |
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@article{1089796, author = {Buršík, Jiří and Buršíková, Vilma and Pešina, Zbyněk and Sopoušek, Jiří}, article_number = {3}, keywords = {solder; silver nanopowder; nanoindentation}, language = {eng}, issn = {1213-7103}, journal = {Chemické listy}, title = {MECHANICAL PROPERTIES AND MICROSTRUCTURE OF MODEL LEAD-FREE JOINTS FOR ELECTRONICS MADE WITH USE OF NANOPOWDERS}, volume = {106}, year = {2012} }
TY - JOUR ID - 1089796 AU - Buršík, Jiří - Buršíková, Vilma - Pešina, Zbyněk - Sopoušek, Jiří PY - 2012 TI - MECHANICAL PROPERTIES AND MICROSTRUCTURE OF MODEL LEAD-FREE JOINTS FOR ELECTRONICS MADE WITH USE OF NANOPOWDERS JF - Chemické listy VL - 106 IS - 3 SP - 390-392 EP - 390-392 SN - 12137103 KW - solder KW - silver nanopowder KW - nanoindentation N2 - Microstructure of Model Lead-Free Joints for Electronics Made with Use of Nanopowders Ag nanopowders were prepared as potential low-toxic constituents of novel solders by a chemical wet synthesis. Resulting nanoparticles were characterized using a transmission electron microscope. Model joints, i.e. sandwiches consisting of thin copper plates with Ag nanopowder interlayer were prepared and annealed at various temperatures. Metallographic cross-sections were studied using a scanning electron microscope. The main emphasis was placed on the characterization of sintered Ag layers on cross-sections by means of nanoindentation experiments. Microhardness and other mechanical properties of sintered Ag layers were measured by instrumented indentation with Berkovich indenter. Both the mechanical properties and the observed microstructure were compared with our previous results obtained on similar materials. ER -
BURŠÍK, Jiří, Vilma BURŠÍKOVÁ, Zbyněk PEŠINA a Jiří SOPOUŠEK. MECHANICAL PROPERTIES AND MICROSTRUCTURE OF MODEL LEAD-FREE JOINTS FOR ELECTRONICS MADE WITH USE OF NANOPOWDERS. \textit{Chemické listy}. 2012, roč.~106, č.~3, s.~390-392. ISSN~1213-7103.
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