Humidity resistant hydrogenated carbon nitride films

J 2013

Humidity resistant hydrogenated carbon nitride films

MIKMEKOVÁ, Eliška; J. POLČÁK; Jaroslav SOBOTA; Ilona MÜLLEROVÁ; Vratislav PEŘINA et al.

Základní údaje

Originální název

Humidity resistant hydrogenated carbon nitride films

Název česky

Vlhkostně odolné hydrogenované vrstvy nitridu uhlíku

Autoři

MIKMEKOVÁ, Eliška; J. POLČÁK; Jaroslav SOBOTA; Ilona MÜLLEROVÁ; Vratislav PEŘINA a Ondřej CAHA

Vydání

Applied Surface Science, Amsterdam, Elsevier Science, 2013, 0169-4332

Další údaje

Jazyk

angličtina

Typ výsledku

Článek v odborném periodiku

Obor

10302 Condensed matter physics

Stát vydavatele

Nizozemské království

Utajení

není předmětem státního či obchodního tajemství

Odkazy

URL

Impakt faktor

Impact factor: 2.538

Označené pro přenos do RIV

Ano

Kód RIV

RIV/00216224:14740/13:00066624

Organizační jednotka

Středoevropský technologický institut

DOI

https://doi.org/10.1016/j.apsusc.2013.03.033

UT WoS

000318977300003

Klíčová slova česky

hydrogenované vrstvy nitridů uhlíku; magnetronové naprašování

Klíčová slova anglicky

Hydrogenated carbon nitride films; Magnetron sputtering; Compressive stress; Desorption; High resolution scanning low energy electron microscopy

Štítky

rivok

Příznaky

Mezinárodní význam, Recenzováno

Změněno: 8. 4. 2014 00:50, Olga Křížová

Anotace

ORIG CZ

V originále

The aim of this study is to prepare the hydrogenated carbon nitrides films which possess good adhesion to silicon substrates and stability in humid surroundings. The films were prepared by magnetron sputtering from pure graphite target in a nitrogen-hydrogen discharge. Two main factors can lead to delamination of the films. The first is the high value of residual stress and the second is the absorption of moisture into the bulk and their affect on films/substrates interface. Both factors were eliminated by adding hydrogen and post-deposition annealing in the vacuum. The influence of annealing (to 200, 400, 600, 800 and 1000 degrees C) on chemical composition and microstructure was studied by various methods. For preparation of humidity (water) resistant films we have added 15% partial pressure of hydrogen to nitrogen discharge and annealed the samples in vacuum to minimum temperature, which was 600 degrees C. The heating to 600 degrees C causes the increasing of carbon -nitride ratio from 2.0 to 2.4 and the relative atomic concentration calculated from XPS data (N 1s peak areas of C-N and C=N) reveals that amount of C-N bonds increases from 49% to 57%. Desorption of absorbed moistures and elements from the film was studied by Thermal Desorption Spectroscopy. Dominant molecules in TDS spectra were HCN and N-2, which were correlated with changes in chemical composition, measured by Rutheford Backscattering Spectroscopy and Elastic Recoil Detection Analysis. For observation of films delamination caused by high compressive stress, the Scanning Low Energy Electron Microscopy was used.

Česky

Vrstvy připravené magnetronovým naprašováním s příspěvkem vodíku a následným žíháním vykázaly zlepšení adhezivity k substrátu a stability ve vlhkém prostředí.

Návaznosti

ED1.1.00/02.0068, projekt VaV

Název: CEITEC - central european institute of technology

GAP204/12/0595, projekt VaV

Název: Elektronové a strukturní vlastnosti trojrozměrných topologických izolantů

Investor: Grantová agentura ČR, Elektronové a strukturní vlastnosti trojrozměrných topologických izolantů

Citovat

MIKMEKOVÁ, Eliška; J. POLČÁK; Jaroslav SOBOTA; Ilona MÜLLEROVÁ; Vratislav PEŘINA a Ondřej CAHA. Humidity resistant hydrogenated carbon nitride films. Applied Surface Science. Amsterdam: Elsevier Science, 2013, roč. 275, Jun, s. 7-13. ISSN 0169-4332. Dostupné z: https://doi.org/10.1016/j.apsusc.2013.03.033.

@article{1137540,
   author = {Mikmeková, Eliška and Polčák, J. and Sobota, Jaroslav and Müllerová, Ilona and Peřina, Vratislav and Caha, Ondřej},
   article_location = {Amsterdam},
   article_number = {Jun},
   doi = {https://doi.org/10.1016/j.apsusc.2013.03.033},
   keywords = {Hydrogenated carbon nitride films; Magnetron sputtering; Compressive stress; Desorption; High resolution scanning low energy electron microscopy},
   language = {eng},
   issn = {0169-4332},
   journal = {Applied Surface Science},
   title = {Humidity resistant hydrogenated carbon nitride films},
   url = {http://www.sciencedirect.com/science/article/pii/S0169433213005011},
   volume = {275},
   year = {2013}
}

TY  - JOUR
ID  - 1137540
AU  - Mikmeková, Eliška - Polčák, J. - Sobota, Jaroslav - Müllerová, Ilona - Peřina, Vratislav - Caha, Ondřej
PY  - 2013
TI  - Humidity resistant hydrogenated carbon nitride films
JF  - Applied Surface Science
VL  - 275
IS  - Jun
SP  - 7-13
EP  - 7-13
PB  - Elsevier Science
SN  - 01694332
KW  - Hydrogenated carbon nitride films
KW  - Magnetron sputtering
KW  - Compressive stress
KW  - Desorption
KW  - High resolution scanning low energy electron microscopy
UR  - http://www.sciencedirect.com/science/article/pii/S0169433213005011
L2  - http://www.sciencedirect.com/science/article/pii/S0169433213005011
N2  - The aim of this study is to prepare the hydrogenated carbon nitrides films which possess good adhesion to silicon substrates and stability in humid surroundings. The films were prepared by magnetron sputtering from pure graphite target in a nitrogen-hydrogen discharge. Two main factors can lead to delamination of the films. The first is the high value of residual stress and the second is the absorption of moisture into the bulk and their affect on films/substrates interface. Both factors were eliminated by adding hydrogen and post-deposition annealing in the vacuum. The influence of annealing (to 200, 400, 600, 800 and 1000 degrees C) on chemical composition and microstructure was studied by various methods. For preparation of humidity (water) resistant films we have added 15% partial pressure of hydrogen to nitrogen discharge and annealed the samples in vacuum to minimum temperature, which was 600 degrees C. The heating to 600 degrees C causes the increasing of carbon -nitride ratio from 2.0 to 2.4 and the relative atomic concentration calculated from XPS data (N 1s peak areas of C-N and C=N) reveals that amount of C-N bonds increases from 49% to 57%. Desorption of absorbed moistures and elements from the film was studied by Thermal Desorption Spectroscopy. Dominant molecules in TDS spectra were HCN and N-2, which were correlated with changes in chemical composition, measured by Rutheford Backscattering Spectroscopy and Elastic Recoil Detection Analysis. For observation of films delamination caused by high compressive stress, the Scanning Low Energy Electron Microscopy was used.
ER  -

MIKMEKOVÁ, Eliška; J. POLČÁK; Jaroslav SOBOTA; Ilona MÜLLEROVÁ; Vratislav PEŘINA a Ondřej CAHA. Humidity resistant hydrogenated carbon nitride films. \textit{Applied Surface Science}. Amsterdam: Elsevier Science, 2013, roč.~275, Jun, s.~7-13. ISSN~0169-4332. Dostupné z: https://doi.org/10.1016/j.apsusc.2013.03.033.

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