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@inproceedings{1202708,
author = {Skácelová, Dana and Čech, Jan and Černák, Mirko},
address = {Zinnowitz},
booktitle = {HAKONE XIV, 2014 Zinnowitz Germany, Book of Contributions},
keywords = {interaction; plasma; surface; barrier discharge;coplanar; DCSBD; Silicon},
howpublished = {paměťový nosič},
language = {eng},
location = {Zinnowitz},
note = {Nepřenášet do RIV - není na WoS ani Scopus, neodpovídá definici druhů výsledků dle M17+},
pages = {481-485},
publisher = {Institute of Physics at the University of Greifswald and the Leibniz Institute for Plasma Science and Technology (INP Greifswald)},
title = {PLASMA-SURFACE INTERACTION EFFECTS DURING ATMOSPHERIC PRESSURE PLASMA MODIFICATION OF SILICON},
year = {2014}
}
TY - JOUR
ID - 1202708
AU - Skácelová, Dana - Čech, Jan - Černák, Mirko
PY - 2014
TI - PLASMA-SURFACE INTERACTION EFFECTS DURING ATMOSPHERIC PRESSURE PLASMA MODIFICATION OF SILICON
PB - Institute of Physics at the University of Greifswald and the Leibniz Institute for Plasma Science and Technology (INP Greifswald)
CY - Zinnowitz
N1 - Nepřenášet do RIV - není na WoS ani Scopus, neodpovídá definici druhů výsledků dle M17+
KW - interaction
KW - plasma
KW - surface
KW - barrier discharge;coplanar
KW - DCSBD
KW - Silicon
N2 - The aim of this work is to study the characterization of plasma-surface interaction of silicon in DCSBD plasma. The influence of the plasma, generated in ambient air on the silicon surface properties with respect to the filamentary nature of DCSBD was studied. Surface properties and chemical composition of silicon were studied by SEM and EDX, respectively. The experimental data were successfully supported by the modeling.
ER -
SKÁCELOVÁ, Dana, Jan ČECH a Mirko ČERNÁK. PLASMA-SURFACE INTERACTION EFFECTS DURING ATMOSPHERIC PRESSURE PLASMA MODIFICATION OF SILICON. In \textit{HAKONE XIV, 2014 Zinnowitz Germany, Book of Contributions}. Zinnowitz: Institute of Physics at the University of Greifswald and the Leibniz Institute for Plasma Science and Technology (INP Greifswald), 2014, s.~481-485.
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