BRZOBOHATY, O., Vilma BURŠÍKOVÁ, David NEČAS, Miroslav VALTR a David TRUNEC. Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation. Journal of physics D: Applied physics. Bristol, England: IOP Publishing Ltd., 2008, roč. 41, č. 3, s. 1-8. ISSN 0022-3727. Dostupné z: https://dx.doi.org/10.1088/0022-3727/41/3/035213. |
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@article{1663725, author = {Brzobohaty, O. and Buršíková, Vilma and Nečas, David and Valtr, Miroslav and Trunec, David}, article_location = {Bristol, England}, article_number = {3}, doi = {http://dx.doi.org/10.1088/0022-3727/41/3/035213}, keywords = {SECONDARY-ELECTRON EMISSION; PARTICLE SIMULATION; THIN-FILMS; DISCHARGES; MODEL; DEPOSITION; SURFACE; ENERGY}, language = {eng}, issn = {0022-3727}, journal = {Journal of physics D: Applied physics}, title = {Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation}, url = {https://iopscience.iop.org/article/10.1088/0022-3727/41/3/035213}, volume = {41}, year = {2008} }
TY - JOUR ID - 1663725 AU - Brzobohaty, O. - Buršíková, Vilma - Nečas, David - Valtr, Miroslav - Trunec, David PY - 2008 TI - Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation JF - Journal of physics D: Applied physics VL - 41 IS - 3 SP - 1-8 EP - 1-8 PB - IOP Publishing Ltd. SN - 00223727 KW - SECONDARY-ELECTRON EMISSION KW - PARTICLE SIMULATION KW - THIN-FILMS KW - DISCHARGES KW - MODEL KW - DEPOSITION KW - SURFACE KW - ENERGY UR - https://iopscience.iop.org/article/10.1088/0022-3727/41/3/035213 L2 - https://iopscience.iop.org/article/10.1088/0022-3727/41/3/035213 N2 - The aim of this work was to investigate the influence of the substrate material on the plasma enhanced chemical vapour deposition and the plasma sputtering of thin films in low pressure (3-20 Pa) parallel-plate radio frequency (rf) discharges. It was observed that the deposition or sputtering rates differed above different materials, e. g. above a substrate and substrate electrode. Moreover, the substrates placed on the bottom rf electrode seemed to be mirrored in the thickness of a thin film deposited or sputtered on the upper grounded electrode. The influence of the substrate material on the plasma parameters was studied via particle in cell/Monte Carlo computer simulation. According to our finding the mirroring of the substrate was caused by different secondary electron emission yields of the substrate material and material of the substrate electrode. This difference in the secondary electron yield affected plasma density above the substrate leading to higher or lower deposition or sputtering rates on the grounded electrode. Therefore, the role of secondary electrons in the discharge was studied. Spatial distributions of impact positions on the grounded electrode for electrons and ions emitted from the rf electrode and created in the ionization avalanche of the secondary electrons were calculated in order to simulate the mirroring of the substrates. ER -
BRZOBOHATY, O., Vilma BURŠÍKOVÁ, David NEČAS, Miroslav VALTR a David TRUNEC. Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation. \textit{Journal of physics D: Applied physics}. Bristol, England: IOP Publishing Ltd., 2008, roč.~41, č.~3, s.~1-8. ISSN~0022-3727. Dostupné z: https://dx.doi.org/10.1088/0022-3727/41/3/035213.
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