Influence of substrate material on plasma in
deposition/sputtering reactor: experiment and computer
simulation

J 2008

Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation

BRZOBOHATY, O., Vilma BURŠÍKOVÁ, David NEČAS, Miroslav VALTR, David TRUNEC et. al.

Základní údaje

Originální název

Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation

Autoři

BRZOBOHATY, O. (garant), Vilma BURŠÍKOVÁ (203 Česká republika, domácí), David NEČAS (203 Česká republika, domácí), Miroslav VALTR (203 Česká republika, domácí) a David TRUNEC (203 Česká republika, domácí)

Vydání

Journal of physics D: Applied physics, Bristol, England, IOP Publishing Ltd. 2008, 0022-3727

Další údaje

Jazyk

angličtina

Typ výsledku

Článek v odborném periodiku

Obor

10300 1.3 Physical sciences

Stát vydavatele

Velká Británie a Severní Irsko

Utajení

není předmětem státního či obchodního tajemství

Odkazy

URL

Impakt faktor

Impact factor: 2.104

Organizační jednotka

Přírodovědecká fakulta

DOI

http://dx.doi.org/10.1088/0022-3727/41/3/035213

UT WoS

000253177800036

Klíčová slova anglicky

SECONDARY-ELECTRON EMISSION; PARTICLE SIMULATION; THIN-FILMS; DISCHARGES; MODEL; DEPOSITION; SURFACE; ENERGY

Štítky

rivok

Příznaky

Mezinárodní význam, Recenzováno

Změněno: 22. 6. 2020 14:54, Mgr. Marie Šípková, DiS.

Anotace

V originále

The aim of this work was to investigate the influence of the substrate material on the plasma enhanced chemical vapour deposition and the plasma sputtering of thin films in low pressure (3-20 Pa) parallel-plate radio frequency (rf) discharges. It was observed that the deposition or sputtering rates differed above different materials, e. g. above a substrate and substrate electrode. Moreover, the substrates placed on the bottom rf electrode seemed to be mirrored in the thickness of a thin film deposited or sputtered on the upper grounded electrode. The influence of the substrate material on the plasma parameters was studied via particle in cell/Monte Carlo computer simulation. According to our finding the mirroring of the substrate was caused by different secondary electron emission yields of the substrate material and material of the substrate electrode. This difference in the secondary electron yield affected plasma density above the substrate leading to higher or lower deposition or sputtering rates on the grounded electrode. Therefore, the role of secondary electrons in the discharge was studied. Spatial distributions of impact positions on the grounded electrode for electrons and ions emitted from the rf electrode and created in the ionization avalanche of the secondary electrons were calculated in order to simulate the mirroring of the substrates.

Návaznosti

GA202/06/0776, projekt VaV

Název: Pokročilý výzkum a vývoj zdrojů nízkoteplotního plazmatu

Investor: Grantová agentura ČR, Pokročilý výzkum a vývoj zdrojů nízkoteplotního plazmatu

GA202/07/1669, projekt VaV

Název: Depozice termomechanicky stabilních nanostrukturovaných diamantu-podobných tenkých vrstev ve dvojfrekvenčních kapacitních výbojích

Investor: Grantová agentura ČR, Depozice termomechanicky stabilních nanostrukturovaných diamantu-podobných tenkých vrstev ve dvojfrekvenčních kapacitních výbojích

MSM0021622411, záměr

Název: Studium a aplikace plazmochemických reakcí v neizotermickém nízkoteplotním plazmatu a jeho interakcí s povrchem pevných látek

Investor: Ministerstvo školství, mládeže a tělovýchovy ČR, Studium a aplikace plazmochemických reakcí v neizotermickém nízkoteplotním plazmatu a jeho interakcí s povrchem pevných látek

Citovat

BRZOBOHATY, O., Vilma BURŠÍKOVÁ, David NEČAS, Miroslav VALTR a David TRUNEC. Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation. Journal of physics D: Applied physics. Bristol, England: IOP Publishing Ltd., 2008, roč. 41, č. 3, s. 1-8. ISSN 0022-3727. Dostupné z: https://dx.doi.org/10.1088/0022-3727/41/3/035213.

@article{1663725,
   author = {Brzobohaty, O. and Buršíková, Vilma and Nečas, David and Valtr, Miroslav and Trunec, David},
   article_location = {Bristol, England},
   article_number = {3},
   doi = {http://dx.doi.org/10.1088/0022-3727/41/3/035213},
   keywords = {SECONDARY-ELECTRON EMISSION; PARTICLE SIMULATION; THIN-FILMS; DISCHARGES; MODEL; DEPOSITION; SURFACE; ENERGY},
   language = {eng},
   issn = {0022-3727},
   journal = {Journal of physics D: Applied physics},
   title = {Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation},
   url = {https://iopscience.iop.org/article/10.1088/0022-3727/41/3/035213},
   volume = {41},
   year = {2008}
}

TY  - JOUR
ID  - 1663725
AU  - Brzobohaty, O. - Buršíková, Vilma - Nečas, David - Valtr, Miroslav - Trunec, David
PY  - 2008
TI  - Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation
JF  - Journal of physics D: Applied physics
VL  - 41
IS  - 3
SP  - 1-8
EP  - 1-8
PB  - IOP Publishing Ltd.
SN  - 00223727
KW  - SECONDARY-ELECTRON EMISSION
KW  - PARTICLE SIMULATION
KW  - THIN-FILMS
KW  - DISCHARGES
KW  - MODEL
KW  - DEPOSITION
KW  - SURFACE
KW  - ENERGY
UR  - https://iopscience.iop.org/article/10.1088/0022-3727/41/3/035213
L2  - https://iopscience.iop.org/article/10.1088/0022-3727/41/3/035213
N2  - The aim of this work was to investigate the influence of the substrate material on the plasma enhanced chemical vapour deposition and the plasma sputtering of thin films in low pressure (3-20 Pa) parallel-plate radio frequency (rf) discharges. It was observed that the deposition or sputtering rates differed above different materials, e. g. above a substrate and substrate electrode. Moreover, the substrates placed on the bottom rf electrode seemed to be mirrored in the thickness of a thin film deposited or sputtered on the upper grounded electrode. The influence of the substrate material on the plasma parameters was studied via particle in cell/Monte Carlo computer simulation. According to our finding the mirroring of the substrate was caused by different secondary electron emission yields of the substrate material and material of the substrate electrode. This difference in the secondary electron yield affected plasma density above the substrate leading to higher or lower deposition or sputtering rates on the grounded electrode. Therefore, the role of secondary electrons in the discharge was studied. Spatial distributions of impact positions on the grounded electrode for electrons and ions emitted from the rf electrode and created in the ionization avalanche of the secondary electrons were calculated in order to simulate the mirroring of the substrates.
ER  -

BRZOBOHATY, O., Vilma BURŠÍKOVÁ, David NEČAS, Miroslav VALTR a David TRUNEC. Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation. \textit{Journal of physics D: Applied physics}. Bristol, England: IOP Publishing Ltd., 2008, roč.~41, č.~3, s.~1-8. ISSN~0022-3727. Dostupné z: https://dx.doi.org/10.1088/0022-3727/41/3/035213.

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