Low-Temperature Atmospheric Pressure Plasma for Applications in
Flexible and Printed Electronics

D 2022

Low-Temperature Atmospheric Pressure Plasma for Applications in Flexible and Printed Electronics

VIDA, Július and Tomáš HOMOLA

Basic information

Original name

Low-Temperature Atmospheric Pressure Plasma for Applications in Flexible and Printed Electronics

Authors

VIDA, Július (703 Slovakia, guarantor, belonging to the institution) and Tomáš HOMOLA (703 Slovakia, belonging to the institution)

Edition

Lecture Notes in Mechanical. Singapore, Proceedings of the 2nd International Conference on Advanced Surface Enhancement (INCASE 2021), p. 66-69, 4 pp. 2022

Publisher

Springer

Other information

Language

English

Type of outcome

Proceedings paper

Field of Study

10305 Fluids and plasma physics

Country of publisher

Singapore

Confidentiality degree

is not subject to a state or trade secret

Publication form

printed version "print"

References:

URL

RIV identification code

RIV/00216224:14310/22:00119220

Organization unit

Faculty of Science

ISBN

978-981-16-5762-7

ISSN

DOI

https://doi.org/10.1007/978-981-16-5763-4_15

EID Scopus

2-s2.0-85115198438

Keywords in English

Low-temperature plasma ;Flexible and printed electronics; Perovskite solar cells; DCSBD; Roll-to-roll

Abstract

In the original language

Low-temperature plasma processing of surfaces and interfaces is an interesting option for applications in flexible and printed electronics where surface cleaning, activation or functionalization are required. Plasma processing compared to more traditional chemical treatment can be significantly cheaper and faster while eliminating the need for toxic organic solvents. Printed functional coatings often contain organic moieties from solvents, binders and other additives that tune the properties of the precursor liquid. These need to be effectively removed for optimal properties of the resulting film. Plasma can provide reactive and energetic species to the surface of printed films for post-printing processing at significantly lower temperatures compared to conventional thermal annealing. In this paper, we summarize applications of low-temperature atmospheric plasma for cleaning of indium tin oxide (ITO) and fluorine-doped tin oxide (FTO) substrates for improved interface quality between the electrode and the blocking layer in perovskite solar cells. Plasma treatment in order of seconds proved as effective as a chemical treatment for an hour. We also present a way for post-deposition mineralization of mesoporous TiO2 electron transport layer for perovskite solar cells at temperatures below 70 °C compatible with temperature-sensitive substrates.

Links

GJ19-14770Y, research and development project

Name: Plazmatem produkované nanostrukturované vrstvy pro flexibilní materiály nové generace

Investor: Czech Science Foundation

Cite

VIDA, Július and Tomáš HOMOLA. Low-Temperature Atmospheric Pressure Plasma for Applications in Flexible and Printed Electronics. In Wei Yuefan, Chng Shuyun. Proceedings of the 2nd International Conference on Advanced Surface Enhancement (INCASE 2021). Lecture Notes in Mechanical. Singapore: Springer, 2022, p. 66-69. ISBN 978-981-16-5762-7. Available from: https://doi.org/10.1007/978-981-16-5763-4_15.

@inproceedings{1793122,
   author = {Vida, Július and Homola, Tomáš},
   address = {Singapore},
   booktitle = {Proceedings of the 2nd International Conference on Advanced Surface Enhancement (INCASE 2021)},
   doi = {https://doi.org/10.1007/978-981-16-5763-4_15},
   edition = {Lecture Notes in Mechanical},
   editor = {Wei Yuefan, Chng Shuyun},
   keywords = {Low-temperature plasma ;Flexible and printed electronics; Perovskite solar cells; DCSBD; Roll-to-roll},
   howpublished = {tištěná verze "print"},
   language = {eng},
   location = {Singapore},
   isbn = {978-981-16-5762-7},
   pages = {66-69},
   publisher = {Springer},
   title = {Low-Temperature Atmospheric Pressure Plasma for Applications in Flexible and Printed Electronics},
   url = {https://doi.org/10.1007/978-981-16-5763-4_15},
   year = {2022}
}

TY  - CONF
ID  - 1793122
AU  - Vida, Július - Homola, Tomáš
PY  - 2022
TI  - Low-Temperature Atmospheric Pressure Plasma for Applications in Flexible and Printed Electronics
PB  - Springer
CY  - Singapore
SN  - 9789811657627
KW  - Low-temperature plasma ;Flexible and printed electronics
KW  - Perovskite solar cells
KW  - DCSBD
KW  - Roll-to-roll
UR  - https://doi.org/10.1007/978-981-16-5763-4_15
N2  - Low-temperature plasma processing of surfaces and interfaces is an interesting option for applications in flexible and printed electronics where surface cleaning, activation or functionalization are required. Plasma processing compared to more traditional chemical treatment can be significantly cheaper and faster while eliminating the need for toxic organic solvents. Printed functional coatings often contain organic moieties from solvents, binders and other additives that tune the properties of the precursor liquid. These need to be effectively removed for optimal properties of the resulting film. Plasma can provide reactive and energetic species to the surface of printed films for post-printing processing at significantly lower temperatures compared to conventional thermal annealing. In this paper, we summarize applications of low-temperature atmospheric plasma for cleaning of indium tin oxide (ITO) and fluorine-doped tin oxide (FTO) substrates for improved interface quality between the electrode and the blocking layer in perovskite solar cells. Plasma treatment in order of seconds proved as effective as a chemical treatment for an hour. We also present a way for post-deposition mineralization of mesoporous TiO2 electron transport layer for perovskite solar cells at temperatures below 70 °C compatible with temperature-sensitive substrates.
ER  -

VIDA, Július and Tomáš HOMOLA. Low-Temperature Atmospheric Pressure Plasma for Applications in Flexible and Printed Electronics. In Wei Yuefan, Chng Shuyun. \textit{Proceedings of the 2nd International Conference on Advanced Surface Enhancement (INCASE 2021)}. Lecture Notes in Mechanical. Singapore: Springer, 2022, p.~66-69. ISBN~978-981-16-5762-7. Available from: https://doi.org/10.1007/978-981-16-5763-4\_{}15.

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