Selective Cu electroplating enabled by surface patterning and
enhanced conductivity of carbon fiber reinforced polymers upon
air plasma etching

J 2024

Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching

RAFAILOVIĆ, Lidija D.; Tomislav TRIŠOVIĆ; Monika STUPAVSKÁ; Pavel SOUČEK; Peter VELICSANYI et al.

Základní údaje

Originální název

Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching

Autoři

Vydání

Journal of Alloys and Compounds, Elsevier B.V. 2024, 0925-8388

Další údaje

Jazyk

angličtina

Typ výsledku

Článek v odborném periodiku

Obor

10305 Fluids and plasma physics

Stát vydavatele

Švýcarsko

Utajení

není předmětem státního či obchodního tajemství

Odkazy

URL

Impakt faktor

Impact factor: 6.300

Označené pro přenos do RIV

Ano

Kód RIV

RIV/00216224:14310/24:00135889

Organizační jednotka

Přírodovědecká fakulta

Klíčová slova anglicky

Composite materials; Air plasma etching; Nanofabrications; In-situ SEM impedance; Selective metallization; Cu microstructure

Štítky

14312030, rivok

Příznaky

Mezinárodní význam, Recenzováno

Změněno: 7. 6. 2024 10:51, Mgr. Marie Novosadová Šípková, DiS.

Anotace

V originále

We demonstrate a sustainable post-processing of carbon fiber reinforced epoxy polymer (CFRP) composites by air plasma etching that permits regular electroconductive surface patterning through direct Cu galvanic metallization, in contrast to the untreated composite. Our study reveals a significant property dependence of the composite with respect to the position to the fiber/matrix composite surface and treatment. The enhancement in electrical conductivity was not compromised by the lower structural integrity of the composite, as the embedded carbon fibers remained unaffected by the air plasma etching process. The metallized Cu domains on the composite exhibit good hardness and excellent solderability potential. Thus, the electroconductive surface patterning of the composite, preceding galvanic metallization, facilitates the selective deposition of Cu layer domains. This step by step process, relying on the creation of selective electroconductive areas on the composite by plasma etching, enables galvanic metallization. Consequently, it enhances the potential for multifunctional composite applications. The feasibility of galvanic metallization brings new perspectives in selective metallization of composites by allowing the tailoring of the metal layer thickness, microstructure and selection of the metal.

Citovat

RAFAILOVIĆ, Lidija D.; Tomislav TRIŠOVIĆ; Monika STUPAVSKÁ; Pavel SOUČEK; Peter VELICSANYI; Sonja NIXON; Adam ELBATAIOUI; Stanislav ZAK; Megan J. CORDILL; Anton HOHENWARTER; Christoph KLEBER a Jozef RÁHEĽ. Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching. Journal of Alloys and Compounds. Elsevier B.V., 2024, roč. 992, July 2024, s. 1-11. ISSN 0925-8388. Dostupné z: https://doi.org/10.1016/j.jallcom.2024.174569.

@article{2397278,
   author = {Rafailović, Lidija D. and Trišović, Tomislav and Stupavská, Monika and Souček, Pavel and Velicsanyi, Peter and Nixon, Sonja and Elbataioui, Adam and Zak, Stanislav and Cordill, Megan J. and Hohenwarter, Anton and Kleber, Christoph and Ráheľ, Jozef},
   article_number = {July 2024},
   doi = {https://doi.org/10.1016/j.jallcom.2024.174569},
   keywords = {Composite materials; Air plasma etching; Nanofabrications; In-situ SEM impedance; Selective metallization; Cu microstructure},
   language = {eng},
   issn = {0925-8388},
   journal = {Journal of Alloys and Compounds},
   title = {Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching},
   url = {https://www.sciencedirect.com/science/article/pii/S0925838824011563},
   volume = {992},
   year = {2024}
}

TY  - JOUR
ID  - 2397278
AU  - Rafailović, Lidija D. - Trišović, Tomislav - Stupavská, Monika - Souček, Pavel - Velicsanyi, Peter - Nixon, Sonja - Elbataioui, Adam - Zak, Stanislav - Cordill, Megan J. - Hohenwarter, Anton - Kleber, Christoph - Ráheľ, Jozef
PY  - 2024
TI  - Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching
JF  - Journal of Alloys and Compounds
VL  - 992
IS  - July 2024
SP  - 1-11
EP  - 1-11
PB  - Elsevier B.V.
SN  - 09258388
KW  - Composite materials
KW  - Air plasma etching
KW  - Nanofabrications
KW  - In-situ SEM impedance
KW  - Selective metallization
KW  - Cu microstructure
UR  - https://www.sciencedirect.com/science/article/pii/S0925838824011563
N2  - We demonstrate a sustainable post-processing of carbon fiber reinforced epoxy polymer (CFRP) composites by air plasma etching that permits regular electroconductive surface patterning through direct Cu galvanic metallization, in contrast to the untreated composite. Our study reveals a significant property dependence of the composite with respect to the position to the fiber/matrix composite surface and treatment. The enhancement in electrical conductivity was not compromised by the lower structural integrity of the composite, as the embedded carbon fibers remained unaffected by the air plasma etching process. The metallized Cu domains on the composite exhibit good hardness and excellent solderability potential. Thus, the electroconductive surface patterning of the composite, preceding galvanic metallization, facilitates the selective deposition of Cu layer domains. This step by step process, relying on the creation of selective electroconductive areas on the composite by plasma etching, enables galvanic metallization. Consequently, it enhances the potential for multifunctional composite applications. The feasibility of galvanic metallization brings new perspectives in selective metallization of composites by allowing the tailoring of the metal layer thickness, microstructure and selection of the metal.
ER  -

RAFAILOVI$\backslash$'C, Lidija D.; Tomislav TRIŠOVI$\backslash$'C; Monika STUPAVSKÁ; Pavel SOUČEK; Peter VELICSANYI; Sonja NIXON; Adam ELBATAIOUI; Stanislav ZAK; Megan J. CORDILL; Anton HOHENWARTER; Christoph KLEBER a Jozef RÁHEĽ. Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching. \textit{Journal of Alloys and Compounds}. Elsevier B.V., 2024, roč.~992, July 2024, s.~1-11. ISSN~0925-8388. Dostupné z: https://doi.org/10.1016/j.jallcom.2024.174569.

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