Floating potential probes for process control during reactive
magnetron sputtering

J 2024

Floating potential probes for process control during reactive magnetron sputtering

VAN BEVER, J.; Petr VAŠINA; Richard Gaetan Paul DREVET; K. STRIJCKMANS; D. DEPLA et al.

Základní údaje

Originální název

Floating potential probes for process control during reactive magnetron sputtering

Autoři

VAN BEVER, J.; Petr VAŠINA; Richard Gaetan Paul DREVET; K. STRIJCKMANS a D. DEPLA

Vydání

Surface and Coatings Technology, Elsevier B.V. 2024, 0257-8972

Další údaje

Jazyk

angličtina

Typ výsledku

Článek v odborném periodiku

Obor

10305 Fluids and plasma physics

Stát vydavatele

Švýcarsko

Utajení

není předmětem státního či obchodního tajemství

Odkazy

URL

Impakt faktor

Impact factor: 6.100

Označené pro přenos do RIV

Ano

Kód RIV

RIV/00216224:14310/24:00137338

Organizační jednotka

Přírodovědecká fakulta

Klíčová slova anglicky

Reactive magnetron sputtering; Process control; Floating potential; Plasma potential

Štítky

14312030, rivok

Příznaky

Mezinárodní význam, Recenzováno

Změněno: 9. 7. 2025 13:28, Mgr. Marie Novosadová Šípková, DiS.

Anotace

V originále

Long term deposition of aluminum oxide by reactive magnetron sputtering results in a drift of the discharge voltage. A similar drift of the floating potential is observed. The latter observation is further investigated and it is shown that the change of the floating potential can be linked to a change of the electric properties of the vacuum chamber walls. Optimization of the floating potential probe is performed to use the difference between the discharge voltage and the floating potential as a parameter for process control. The best results were obtained with a planar probe sufficiently far positioned opposite to the magnetron, and close enough to the chamber wall facing the magnetron. This choice can be understood in terms of the ability of the probe to sense the discharge while being protected from deposition. The usage of the aforementioned difference to control the process is demonstrated with the measurement of process curves, more specifically IV-characteristics and hysteresis experiments. The shown reproducibility of these measurements opens a pathway for more precise quantification of reactive sputter deposition simulations and enhanced process control.

Návaznosti

90239, velká výzkumná infrastruktura

Název: CEPLANT II

Citovat

VAN BEVER, J.; Petr VAŠINA; Richard Gaetan Paul DREVET; K. STRIJCKMANS a D. DEPLA. Floating potential probes for process control during reactive magnetron sputtering. Surface and Coatings Technology. Elsevier B.V., 2024, roč. 494, October 2024, s. 131405-131414. ISSN 0257-8972. Dostupné z: https://doi.org/10.1016/j.surfcoat.2024.131405.

@article{2443524,
   author = {Van Bever, J. and Vašina, Petr and Drevet, Richard Gaetan Paul and Strijckmans, K. and Depla, D.},
   article_number = {October 2024},
   doi = {https://doi.org/10.1016/j.surfcoat.2024.131405},
   keywords = {Reactive magnetron sputtering; Process control; Floating potential; Plasma potential},
   language = {eng},
   issn = {0257-8972},
   journal = {Surface and Coatings Technology},
   title = {Floating potential probes for process control during reactive magnetron sputtering},
   url = {https://www.sciencedirect.com/science/article/pii/S0257897224010363?via%3Dihub},
   volume = {494},
   year = {2024}
}

TY  - JOUR
ID  - 2443524
AU  - Van Bever, J. - Vašina, Petr - Drevet, Richard Gaetan Paul - Strijckmans, K. - Depla, D.
PY  - 2024
TI  - Floating potential probes for process control during reactive magnetron sputtering
JF  - Surface and Coatings Technology
VL  - 494
IS  - October 2024
SP  - 131405
EP  - 131405
PB  - Elsevier B.V.
SN  - 02578972
KW  - Reactive magnetron sputtering
KW  - Process control
KW  - Floating potential
KW  - Plasma potential
UR  - https://www.sciencedirect.com/science/article/pii/S0257897224010363?via%3Dihub
N2  - Long term deposition of aluminum oxide by reactive magnetron sputtering results in a drift of the discharge voltage. A similar drift of the floating potential is observed. The latter observation is further investigated and it is shown that the change of the floating potential can be linked to a change of the electric properties of the vacuum chamber walls. Optimization of the floating potential probe is performed to use the difference between the discharge voltage and the floating potential as a parameter for process control. The best results were obtained with a planar probe sufficiently far positioned opposite to the magnetron, and close enough to the chamber wall facing the magnetron. This choice can be understood in terms of the ability of the probe to sense the discharge while being protected from deposition. The usage of the aforementioned difference to control the process is demonstrated with the measurement of process curves, more specifically IV-characteristics and hysteresis experiments. The shown reproducibility of these measurements opens a pathway for more precise quantification of reactive sputter deposition simulations and enhanced process control.
ER  -

VAN BEVER, J.; Petr VAŠINA; Richard Gaetan Paul DREVET; K. STRIJCKMANS a D. DEPLA. Floating potential probes for process control during reactive magnetron sputtering. \textit{Surface and Coatings Technology}. Elsevier B.V., 2024, roč.~494, October 2024, s.~131405-131414. ISSN~0257-8972. Dostupné z: https://doi.org/10.1016/j.surfcoat.2024.131405.

Přehled o publikaci