| ODRÁŠKOVÁ, Mária, Jozef RÁHEĽ, Anna ZAHORANOVÁ, Radovan TIŇO a Mirko ČERNÁK. Plasma Activation of Wood Surface by Diffuse Coplanar Surface Barrier Discharge. Plasma Chemistry and Plasma Processing. 2008, roč. 28, č. 2, s. 203-211. ISSN 0272-4324. |
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@article{818091,
author = {Odrášková, Mária and Ráheľ, Jozef and Zahoranová, Anna and Tiňo, Radovan and Černák, Mirko},
article_number = {2},
keywords = {Oak wood - Plasma activation - Atmospheric pressure plasma - DCSBD - Coplanar discharge},
language = {eng},
issn = {0272-4324},
journal = {Plasma Chemistry and Plasma Processing},
title = {Plasma Activation of Wood Surface by Diffuse Coplanar Surface Barrier Discharge},
url = {http://www.springerlink.com/content/084t050427u172k2/},
volume = {28},
year = {2008}
}
TY - JOUR
ID - 818091
AU - Odrášková, Mária - Ráheľ, Jozef - Zahoranová, Anna - Tiňo, Radovan - Černák, Mirko
PY - 2008
TI - Plasma Activation of Wood Surface by Diffuse Coplanar Surface Barrier Discharge
JF - Plasma Chemistry and Plasma Processing
VL - 28
IS - 2
SP - 203-211
EP - 203-211
SN - 02724324
KW - Oak wood - Plasma activation - Atmospheric pressure plasma - DCSBD - Coplanar discharge
UR - http://www.springerlink.com/content/084t050427u172k2/
N2 - Radial cuts of Pedunculate oak (Quercus robur L.) heartwood was activated by Diffuse Coplanar Surface Barrier Discharge (DCSBD) plasma. The plasma treatment resulted in a considerable increase of free surface energy and in the substantial reduction of 50 microL water droplet uptake time. FTIR analysis confirmed the formation of additional polar functional groups on the wood surface due to the plasma treatment. This is consistent with the shift of wood surface pH level towards more acidic values. The energy efficiency of the DCSBD plasma treatment is better comparing to the known volume dielectric barrier discharge treatment method.
ER -
ODRÁŠKOVÁ, Mária, Jozef RÁHEĽ, Anna ZAHORANOVÁ, Radovan TIŇO a Mirko ČERNÁK. Plasma Activation of Wood Surface by Diffuse Coplanar Surface Barrier Discharge. \textit{Plasma Chemistry and Plasma Processing}. 2008, roč.~28, č.~2, s.~203-211. ISSN~0272-4324.
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