| LEHOCKÝ, Marian, Pavel SŤAHEL, Marek KOUTNÝ, Jan ČECH, Jakub INSTITORIS and Aleš MRÁČEK. Adhesion of Rhodococcus sp. S3E2 and Rhodococcus sp. S3E3 to plasma prepared Teflon-like and organosilicon surfaces. Journal of Materials Processing Technology. Elsevier B.V., 2008, vol. 209, No 6, p. 2871–2875. ISSN 0924-0136. |
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@article{834329,
author = {Lehocký, Marian and Sťahel, Pavel and Koutný, Marek and Čech, Jan and Institoris, Jakub and Mráček, Aleš},
article_number = {6},
keywords = {Rhodococcus; Plasma deposition; Cell adhesion; Barrier discharge; Thin films},
language = {eng},
issn = {0924-0136},
journal = {Journal of Materials Processing Technology},
note = {doi:10.1016/j.jmatprotec.2008.06.042},
title = {Adhesion of Rhodococcus sp. S3E2 and Rhodococcus sp. S3E3 to plasma prepared Teflon-like and organosilicon surfaces},
volume = {209},
year = {2008}
}
TY - JOUR
ID - 834329
AU - Lehocký, Marian - Sťahel, Pavel - Koutný, Marek - Čech, Jan - Institoris, Jakub - Mráček, Aleš
PY - 2008
TI - Adhesion of Rhodococcus sp. S3E2 and Rhodococcus sp. S3E3 to plasma prepared Teflon-like and organosilicon surfaces
JF - Journal of Materials Processing Technology
VL - 209
IS - 6
SP - 2871–2875
EP - 2871–2875
PB - Elsevier B.V.
SN - 09240136
N1 - doi:10.1016/j.jmatprotec.2008.06.042
KW - Rhodococcus
KW - Plasma deposition
KW - Cell adhesion
KW - Barrier discharge
KW - Thin films
N2 - Investigation of Rhodococcus SP.S3E2 and Rhodococcus SP.S3E3 adhesion to hydrophobic teflon like films and organosilicon films deposited on the paper substrate.
ER -
LEHOCKÝ, Marian, Pavel SŤAHEL, Marek KOUTNÝ, Jan ČECH, Jakub INSTITORIS and Aleš MRÁČEK. Adhesion of Rhodococcus sp. S3E2 and Rhodococcus sp. S3E3 to plasma prepared Teflon-like and organosilicon surfaces. \textit{Journal of Materials Processing Technology}. Elsevier B.V., 2008, vol.~209, No~6, p.~2871–2875. ISSN~0924-0136.
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