2009
On the stability of Ag, Cu, and Sn nanoparticles
BROŽ, Pavel, Jiří SOPOUŠEK a Jan VŘEŠŤÁLZákladní údaje
Originální název
On the stability of Ag, Cu, and Sn nanoparticles
Název česky
Stabilita Ag, Cu, Sn nanočástic.
Název anglicky
On the stability of Ag, Cu, and Sn nanoparticles
Autoři
BROŽ, Pavel (203 Česká republika, garant, domácí), Jiří SOPOUŠEK (203 Česká republika, domácí) a Jan VŘEŠŤÁL (203 Česká republika, domácí)
Vydání
CALPHAD XXXVIII (Praha, May 17-22, 2009), 2009
Další údaje
Jazyk
čeština
Typ výsledku
Konferenční abstrakt
Obor
10403 Physical chemistry
Stát vydavatele
Slovensko
Utajení
není předmětem státního či obchodního tajemství
Kód RIV
RIV/00216224:14310/09:00049590
Organizační jednotka
Přírodovědecká fakulta
Klíčová slova česky
CALPHAD; termická analýza; nano; fázové diagramy
Klíčová slova anglicky
CALPHAD; thermal analysis; nano; phase diagram
Štítky
Příznaky
Mezinárodní význam
Změněno: 5. 4. 2012 10:34, Iva Klímová
V originále
Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected. In order to get new information in this field, stability of Ag, Cu and Sn nanopoparticles and surface effects as well as potential application for soldering technology were studied. DSC measurements by means of STA 409 CD/3/5/G apparatus from Netzsch, X-ray diffraction analysis on PANalytical X Pert PRO MPD device equipped with X Celerator detector and transmission electron microscopy (TEM) in a Philips CM12 STEM apparatus were basic methods used for experimental investigations. Experimental results were confronted with theoretical calculations based on the CALPHAD approach.
Anglicky
Metal nanoparticles are considered as potential candidates for use as solder materials for high temperature applications. It is known that physical, electronic, and thermodynamic properties of nano-objects are significantly different from those of the bulk materials because of the effect of decrease of melting point of small particles below the melting point of the bulk material. Exploiting this effect, the substantial depression of melting temperature of lead-free solders could be reached, sparing energy, expenses, being friendly to the environment at the same time. One the other hand the main problem of lead-free solder materials is surface oxidation or reactions which decrease for example the wettability of the solder. As the volume ratio of the metal in oxide layer increases with decreasing particle radius the materials have to be protected. In order to get new information in this field, stability of Ag, Cu and Sn nanopoparticles and surface effects as well as potential application for soldering technology were studied. DSC measurements by means of STA 409 CD/3/5/G apparatus from Netzsch, X-ray diffraction analysis on PANalytical X Pert PRO MPD device equipped with X Celerator detector and transmission electron microscopy (TEM) in a Philips CM12 STEM apparatus were basic methods used for experimental investigations. Experimental results were confronted with theoretical calculations based on the CALPHAD approach.
Návaznosti
| GA106/09/0700, projekt VaV |
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| OC09010, projekt VaV |
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