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@proceedings{852003,
author = {Sopoušek, Jiří},
booktitle = {EUROMAT 2009 (7-10 September, 2009)},
keywords = {CALPHAD; DSC; thermal analysis; phase diagram},
language = {eng},
title = {Interaction of Cu, Sn, and Ag nano-powders with Cu substrate},
year = {2009}
}
TY - CONF
ID - 852003
AU - Sopoušek, Jiří
PY - 2009
TI - Interaction of Cu, Sn, and Ag nano-powders with Cu substrate
KW - CALPHAD
KW - DSC
KW - thermal analysis
KW - phase diagram
N2 - The contribution deals with nano-particles and raised from selected pure metals (Cu, Ag, Sn). The temperature behaviours of these powders under inert atmosphere and under reactive gas are studied as well as the particles / Cu substrate systems. The measurements of the thermal stability of the metal particles were obtained using DSC. It enables to evaluate heat effects of oxidation process, sintering, solid and liquid temperatures. The Cu-substrate / metal powder interlayer / Cu-substrate sandwich samples were also investigated experimentally using DSC technique. This experiment simulates real soldering process using sandwich samples inside DSC. The microstructure and phase compositions of the samples obtained in consequence of different temperature/rate/atmosphere conditions inside DSC were investigated. The samples were investigated: microstructure, porosity, phase composition, diffusion profiles, etc. (SEM, WDX, TEM). The CALPHAD approach was used for the phase diagram calculations.
ER -
SOPOUŠEK, Jiří. Interaction of Cu, Sn, and Ag nano-powders with Cu substrate. In \textit{EUROMAT 2009 (7-10 September, 2009)}. 2009.
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