Thermal analysis of selected tin-based lead-free solder alloys

J 2009

Thermal analysis of selected tin-based lead-free solder alloys

PALCUT, Marian; Jiří SOPOUŠEK; Libuše TRNKOVÁ; Beáta SZEWCZYKOVA; Erika HODÚLOVÁ et al.

Základní údaje

Originální název

Thermal analysis of selected tin-based lead-free solder alloys

Název česky

Termická analýza vybraných bezolovnatých pájek na cínové bázi

Autoři

PALCUT, Marian; Jiří SOPOUŠEK; Libuše TRNKOVÁ; Beáta SZEWCZYKOVA; Erika HODÚLOVÁ; Milan OŽVOLD; Milan TURŇA a Jozef JANOVEC

Vydání

Kovové materiály, Bratislava, 2009, 0023-432X

Další údaje

Jazyk

angličtina

Typ výsledku

Článek v odborném periodiku

Obor

10302 Condensed matter physics

Stát vydavatele

Slovensko

Utajení

není předmětem státního či obchodního tajemství

Impakt faktor

Impact factor: 1.345 v roce 2007

Označené pro přenos do RIV

Ano

Kód RIV

RIV/00216224:14310/09:00037461

Organizační jednotka

Přírodovědecká fakulta

UT WoS

000267933100007

Klíčová slova anglicky

solder; thermal analysis; Sn-Ag-Cu alloy

Změněno: 8. 12. 2009 13:47, RNDr. Kamila Neplechová, Ph.D.

Anotace

ORIG CZ

V originále

The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodynamic calculations using the CALPHAD approach. The amount of the alloying elements in the materials was chosen to be close to the respective eutectic composition and the nominal compositions were the following: Sn-3.7Ag-0.7Cu, Sn-1.0Ag-0.5Cu-1Bi (in wt.%). Thermal effects during melting and solidifying were experimentally studied by the DSC technique. The microstructure of the samples was determined by the light microscopy and the composition of solidified phases was obtained by the energy-dispersive X-ray spectroscopy, respectively. The solidification behaviour under equilibrium conditions was simulated using the Thermo-Calc software package. This approach enabled us to obtain the enthalpy of cooling for each alloy and to compare its temperature derivative with the experimental DSC curves.

Česky

Slitiny Sn-Ag-Cu mají dobré pájecí vlastnosti, a uvažuje se o nich tedy jako vhodných materiálech pro bezolovnaté pájky. V této práci byly tyto sloučeniny studovány pomocí diferenční skenovací kalorimetrie a výpočetního systému CALPHAD.

Návaznosti

MSM0021622410, záměr

Název: Fyzikální a chemické vlastnosti pokročilých materiálů a struktur

Investor: Ministerstvo školství, mládeže a tělovýchovy ČR, Fyzikální a chemické vlastnosti pokročilých materiálů a struktur

Citovat

PALCUT, Marian; Jiří SOPOUŠEK; Libuše TRNKOVÁ; Beáta SZEWCZYKOVA; Erika HODÚLOVÁ; Milan OŽVOLD; Milan TURŇA a Jozef JANOVEC. Thermal analysis of selected tin-based lead-free solder alloys. Kovové materiály. Bratislava, 2009, roč. 47, č. 1, 8 s. ISSN 0023-432X.

@article{858801,
   author = {Palcut, Marian and Sopoušek, Jiří and Trnková, Libuše and Szewczykova, Beáta and Hodúlová, Erika and Ožvold, Milan and Turňa, Milan and Janovec, Jozef},
   article_location = {Bratislava},
   article_number = {1},
   keywords = {solder; thermal analysis; Sn-Ag-Cu alloy},
   language = {eng},
   issn = {0023-432X},
   journal = {Kovové materiály},
   title = {Thermal analysis of selected tin-based lead-free solder alloys},
   volume = {47},
   year = {2009}
}

TY  - JOUR
ID  - 858801
AU  - Palcut, Marian - Sopoušek, Jiří - Trnková, Libuše - Szewczykova, Beáta - Hodúlová, Erika - Ožvold, Milan - Turňa, Milan - Janovec, Jozef
PY  - 2009
TI  - Thermal analysis of selected tin-based lead-free solder alloys
JF  - Kovové materiály
VL  - 47
IS  - 1
SN  - 0023432X
KW  - solder
KW  - thermal analysis
KW  - Sn-Ag-Cu alloy
N2  - The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodynamic calculations using the CALPHAD approach. The amount of the alloying elements in the materials was chosen to be close to the respective eutectic composition and the nominal compositions were the following: Sn-3.7Ag-0.7Cu, Sn-1.0Ag-0.5Cu-1Bi (in wt.%). Thermal effects during melting and solidifying were experimentally studied by the DSC technique. The microstructure of the samples was determined by the light microscopy and the composition of solidified phases was obtained by the energy-dispersive X-ray spectroscopy, respectively. The solidification behaviour under equilibrium conditions was simulated using the Thermo-Calc software package. This approach enabled us to obtain the enthalpy of cooling for each alloy and to compare its temperature derivative with the experimental DSC curves.
ER  -

PALCUT, Marian; Jiří SOPOUŠEK; Libuše TRNKOVÁ; Beáta SZEWCZYKOVA; Erika HODÚLOVÁ; Milan OŽVOLD; Milan TURŇA a Jozef JANOVEC. Thermal analysis of selected tin-based lead-free solder alloys. \textit{Kovové materiály}. Bratislava, 2009, roč.~47, č.~1, 8 s. ISSN~0023-432X.

Přehled o publikaci