| PALCUT, Marian, Jiří SOPOUŠEK, Libuše TRNKOVÁ, Beáta SZEWCZYKOVA, Erika HODÚLOVÁ, Milan OŽVOLD, Milan TURŇA a Jozef JANOVEC. Thermal analysis of selected tin-based lead-free solder alloys. Kovové materiály. Bratislava, 2009, roč. 47, č. 1, 8 s. ISSN 0023-432X. |
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@article{858801,
author = {Palcut, Marian and Sopoušek, Jiří and Trnková, Libuše and Szewczykova, Beáta and Hodúlová, Erika and Ožvold, Milan and Turňa, Milan and Janovec, Jozef},
article_location = {Bratislava},
article_number = {1},
keywords = {solder; thermal analysis; Sn-Ag-Cu alloy},
language = {eng},
issn = {0023-432X},
journal = {Kovové materiály},
title = {Thermal analysis of selected tin-based lead-free solder alloys},
volume = {47},
year = {2009}
}
TY - JOUR
ID - 858801
AU - Palcut, Marian - Sopoušek, Jiří - Trnková, Libuše - Szewczykova, Beáta - Hodúlová, Erika - Ožvold, Milan - Turňa, Milan - Janovec, Jozef
PY - 2009
TI - Thermal analysis of selected tin-based lead-free solder alloys
JF - Kovové materiály
VL - 47
IS - 1
SN - 0023432X
KW - solder
KW - thermal analysis
KW - Sn-Ag-Cu alloy
N2 - The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodynamic calculations using the CALPHAD approach. The amount of the alloying elements in the materials was chosen to be close to the respective eutectic composition and the nominal compositions were the following: Sn-3.7Ag-0.7Cu, Sn-1.0Ag-0.5Cu-1Bi (in wt.%). Thermal effects during melting and solidifying were experimentally studied by the DSC technique. The microstructure of the samples was determined by the light microscopy and the composition of solidified phases was obtained by the energy-dispersive X-ray spectroscopy, respectively. The solidification behaviour under equilibrium conditions was simulated using the Thermo-Calc software package. This approach enabled us to obtain the enthalpy of cooling for each alloy and to compare its temperature derivative with the experimental DSC curves.
ER -
PALCUT, Marian, Jiří SOPOUŠEK, Libuše TRNKOVÁ, Beáta SZEWCZYKOVA, Erika HODÚLOVÁ, Milan OŽVOLD, Milan TURŇA a Jozef JANOVEC. Thermal analysis of selected tin-based lead-free solder alloys. \textit{Kovové materiály}. Bratislava, 2009, roč.~47, č.~1, 8 s. ISSN~0023-432X.
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