2008
Spectroscopic elipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films
MARŠÍK, Přemysl; Patrick VERDONCK; Dieter SCHNEIDER; David DE ROEST; Shinya KANEKO et. al.Základní údaje
Originální název
Spectroscopic elipsometry and ellipsometric porosimetry studies of CVD low-k dielectric films
Název česky
Spektroelipsometrická a porosimetrická studie CVD low-k dielektrických filmů
Autoři
MARŠÍK, Přemysl; Patrick VERDONCK; Dieter SCHNEIDER; David DE ROEST; Shinya KANEKO a Mikhail BAKLANOV
Vydání
physica status solidi (c), Weinheim, WILEY-VCH Verlag GmbH, 2008, 1610-1634
Další údaje
Jazyk
angličtina
Typ výsledku
Článek v odborném periodiku
Obor
10302 Condensed matter physics
Stát vydavatele
Belgie
Utajení
není předmětem státního či obchodního tajemství
Kód RIV
RIV/00216224:14310/08:00026014
Organizační jednotka
Přírodovědecká fakulta
UT WoS
000256862500061
Klíčová slova anglicky
low-k dielectrics; ellipsometry; porosimetry
Štítky
Příznaky
Mezinárodní význam, Recenzováno
Změněno: 9. 7. 2009 09:58, Mgr. Přemysl Maršík, Ph.D.
V originále
Aurora ELK, a porous low-k SiCOH film deposited by CVD, was used to study the effect of UV curing. Samples were cured for various curing times and the purpose of this work is to observe the effects of UV curing on optical, mechanical and structural properties of the low-k film. We have used 1) ellipsometric porosimetry to determine the porosity and the pore-size distribution and 2) nitrogen purged UV ellipsometry in a range from 2 to 9 eV to observe the changes of the di-electric function of the cured material. Additional FTIR and laser-induced surface acoustic wave measurements were performed. The porogen removal and the increase of porosity were observed, and a k-value of 2.3 was reached for the optimum curing time. However for longer curing times, densification and reduction of the porosity occurs. The growth of the hydrogen incorporation has been observed.
Česky
Aurora ELK, a porous low-k SiCOH film deposited by CVD, was used to study the effect of UV curing. Samples were cured for various curing times and the purpose of this work is to observe the effects of UV curing on optical, mechanical and structural properties of the low-k film. We have used 1) ellipsometric porosimetry to determine the porosity and the pore-size distribution and 2) nitrogen purged UV ellipsometry in a range from 2 to 9 eV to observe the changes of the di-electric function of the cured material. Additional FTIR and laser-induced surface acoustic wave measurements were performed. The porogen removal and the increase of porosity were observed, and a k-value of 2.3 was reached for the optimum curing time. However for longer curing times, densification and reduction of the porosity occurs. The growth of the hydrogen incorporation has been observed.
Návaznosti
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